Inventor
MALING JEFFREY C
US42 patents
⚠️ This page may combine multiple inventors who share the name “MALING JEFFREY C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
31 patentsUS9862598B2Jan 9, 2018
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM20 citations98
US9815690B2Nov 14, 2017
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM26 citations98
US9041128B2May 26, 2015
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM30 citations98
US10414646B2Sep 17, 2019
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM7 citations92
US10093537B2Oct 9, 2018
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM6 citations92
US11021364B2Jun 1, 2021
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM0 citations73
US10906803B2Feb 2, 2021
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM0 citations73
US10476227B2Nov 12, 2019
Dual bond pad structure for photonics
IBM3 citations73
US9608403B2Mar 28, 2017
Dual bond pad structure for photonics
IBM2 citations73
US10081534B2Sep 25, 2018
Semiconductor structures provided within a cavity and related design structures
IBM2 citations72
US7098067B2Aug 29, 2006
Masked sidewall implant for image sensor
IBM7 citations71
US9890039B2Feb 13, 2018
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM0 citations63
US9764944B2Sep 19, 2017
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM0 citations63
US9493343B2Nov 15, 2016
Planar cavity MEMS and related structures, methods of manufacture and design structures
IBM0 citations63
US11167980B2Nov 9, 2021
Micro-electro-mechanical system (MEMS) structures and design structures
IBM0 citations62
US10978416B2Apr 13, 2021
Dual bond pad structure for photonics
IBM0 citations62
US10882736B2Jan 5, 2021
Semiconductor structures provided within a cavity and related design structures
IBM0 citations61
US9455214B2Sep 27, 2016
Wafer frontside-backside through silicon via
IBM2 citations60
US7893479B2Feb 22, 2011
Deep trench in a semiconductor structure
IBM1 citations59
US7101806B2Sep 5, 2006
Deep trench formation in semiconductor device fabrication
IBM4 citations59
US10833038B2Nov 10, 2020
Dual bond pad structure for photonics
IBM0 citations52
US10589991B2Mar 17, 2020
Micro-electro-mechanical system (MEMS) structures and design structures
IBM0 citations51
US10589992B2Mar 17, 2020
Micro-electro-mechanical system (MEMS) structures and design structures
IBM0 citations51
US10549987B2Feb 4, 2020
Micro-electro-mechanical system (MEMS) structures and design structures
IBM0 citations51
US10227230B2Mar 12, 2019
Semiconductor structures provided within a cavity and related design structures
IBM0 citations51
US9981842B2May 29, 2018
Micro-Electro-Mechanical System (MEMS) structures and design structures
IBM0 citations51
US9969613B2May 15, 2018
Method for forming micro-electro-mechanical system (MEMS) beam structure
IBM0 citations51
US9938137B2Apr 10, 2018
Micro-electro-mechanical system (MEMS) structures and design structures
IBM0 citations51
US9932222B2Apr 3, 2018
Micro-electro-mechanical system (MEMS) structures and design structures
IBM0 citations51
US9043743B2May 26, 2015
Automated residual material detection
IBM0 citations49
US7573085B2Aug 11, 2009
Deep trench formation in semiconductor device fabrication
IBM0 citations48