Inventor
JUN HYUNSU
KR14 patents
⚠️ This page may combine multiple inventors who share the name “JUN HYUNSU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
13 patentsUS10177188B2Jan 8, 2019
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD41 citations96
US11482554B2Oct 25, 2022
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations71
US11392012B2Jul 19, 2022
Multi-input folded camera and mobile device including the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US10868073B2Dec 15, 2020
Method of fabricating semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations71
US9966401B2May 8, 2018
Package for image sensor with outer and inner frames
SAMSUNG ELECTRONICS CO LTD3 citations71
US11252308B2Feb 15, 2022
Camera module and imaging apparatus including the same
SAMSUNG ELECTRONICS CO LTD2 citations70
US11218651B2Jan 4, 2022
Image sensor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11914271B2Feb 27, 2024
Multi-input folded camera and mobile device including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11380726B2Jul 5, 2022
Sensor device
SAMSUNG ELECTRONICS CO LTD1 citations61
US11563874B2Jan 24, 2023
Camera module and imaging apparatus including the same
SAMSUNG ELECTRONICS CO LTD0 citations59
US11086099B2Aug 10, 2021
Light-folding camera and mobile device including the same
SAMSUNG ELECTRONICS CO LTD1 citations56
US9634046B2Apr 25, 2017
Semiconductor packages including electrical insulation features
SAMSUNG ELECTRONICS CO LTD0 citations50
US11949975B2Apr 2, 2024
Camera module and imaging apparatus including the same
SAMSUNG ELECTRONICS CO LTD0 citations45