Inventor · disambiguated record
Moon Gi Cho
Also filed as: CHO MOON-GI
16 granted patents·9 pending applications·84 citations·filing 2008–2022
91Inventor score
Files withSAMSUNG ELECTRONICS CO LTD15CHO MOON-GI4K C TECH CO LTD2KCTECH CO LTD1KOREA ADVANCED INST SCI & TECH1
Top patents by PatentIndex Score
25 records- 0194US8710657B2Semiconductor assembly and semiconductor package including a solder channelPARK JEONG-WOO·Filed 2011·Granted Apr 29, 2014·36 cites·18 claims
- 0287US10347627B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 9, 2019·6 cites·20 claims
- 0387US8980739B2Solder collapse free bumping process of semiconductor deviceCHO MOON-GI·Filed 2012·Granted Mar 17, 2015·11 cites·17 claims
- 0486US9245771B2Semiconductor packages having through electrodes and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 26, 2016·8 cites·30 claims
- 0585US9123725B2Semiconductor device having fuse patternSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 1, 2015·6 cites·17 claims
- 0683US10518382B2Substrate processing systemK C TECH CO LTD·Filed 2016·Granted Dec 31, 2019·6 cites·35 claims
- 0778US8922008B2Bump structure, having concave lateral sides, semiconductor package having the bump structure, and method of forming the bump structureSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 30, 2014·5 cites·14 claims
- 0871US10453838B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 22, 2019·1 cites·20 claims
- 0970US9704729B2Substrate cleaning apparatus and method and brush assembly used thereinK C TECH CO LTD·Filed 2014·Granted Jul 11, 2017·2 cites·20 claims
- 1065US9312213B2Bump structures having an extensionCHO MOON GI·Filed 2013·Granted Apr 12, 2016·2 cites·31 claims
- 1160US10211089B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 19, 2019·1 cites·19 claims
- 1260US2021167063A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 1358US10636785B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 28, 2020·0 cites·20 claims
- 1456US10930648B2Semiconductor devices having multi-level metallization structuresSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 23, 2021·0 cites·20 claims
- 1551US9449918B2Semiconductor device having fuse patternSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Sep 20, 2016·0 cites·11 claims
- 1648US2022274264A1Substrate transferring systemKCTECH CO LTD·Filed 2022·Application pending·0 cites
- 1748US2009212422A1JOINT RELIABILITY OF SOLDER JOINT BETWEEN Sn-yAg SOLDER AND Ni-P UNDER BUMP METALLIC LAYER BY COBALT ADDITIONKOREA ADVANCED INST SCI & TECH·Filed 2008·Application pending·0 cites
- 1841US8928150B2Multi-chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 6, 2015·0 cites·5 claims
- 1940US2013256876A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 2040US2013009286A1Semiconductor chip and flip-chip package comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 2139US10770384B2Printed circuit board having insulating metal oxide layer covering connection padSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 8, 2020·0 cites·18 claims
- 2237US2013082090A1Methods of forming connection bump of semiconductor deviceCHO MOON-GI·Filed 2012·Application pending·0 cites
- 2335US2016329275A1Package substrate and methods for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 2435US2012129333A1Method for manufacturing semiconductor package and semiconductor package manufactured using the sameYIM HA-YOUNG·Filed 2011·Application pending·0 cites
- 2532US2015364387A1Wafer polishing methodCHO MOON-GI·Filed 2015·Application pending·0 cites
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