Inventor
CORLISS DANIEL A
US21 patents
⚠️ This page may combine multiple inventors who share the name “CORLISS DANIEL A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
18 patentsUS10553522B1Feb 4, 2020
Semiconductor microcooler
IBM20 citations94
US10553516B1Feb 4, 2020
Semiconductor microcooler
IBM10 citations84
US7439001B2Oct 21, 2008
Focus blur measurement and control method
IBM13 citations83
US7230681B2Jun 12, 2007
Method and apparatus for immersion lithography
IBM8 citations74
US10490481B1Nov 26, 2019
Copper microcooler structure and fabrication
IBM3 citations73
US10490480B1Nov 26, 2019
Copper microcooler structure and fabrication
IBM4 citations73
US10274836B2Apr 30, 2019
Determination of lithography effective dose uniformity
IBM3 citations71
US10642161B1May 5, 2020
Baseline overlay control with residual noise reduction
IBM5 citations69
US11056418B2Jul 6, 2021
Semiconductor microcooler
IBM0 citations62
US11049789B2Jun 29, 2021
Semiconductor microcooler
IBM0 citations62
US9104113B2Aug 11, 2015
Amplification method for photoresist exposure in semiconductor chip manufacturing
IBM2 citations62
US6919146B2Jul 19, 2005
Planar reticle design/fabrication method for rapid inspection and cleaning
IBM4 citations62
US10281826B2May 7, 2019
Determination of lithography effective dose uniformity
IBM1 citations61
US9709898B2Jul 18, 2017
Amplification method for photoresist exposure in semiconductor chip manufacturing
IBM1 citations52
US7807335B2Oct 5, 2010
Immersion lithography contamination gettering layer
IBM1 citations50
US9451684B2Sep 20, 2016
Dual pulse driven extreme ultraviolet (EUV) radiation source method
IBM0 citations48
US9301381B1Mar 29, 2016
Dual pulse driven extreme ultraviolet (EUV) radiation source utilizing a droplet comprising a metal core with dual concentric shells of buffer gas
IBM0 citations48
US7351348B2Apr 1, 2008
Evaporation control using coating
IBM0 citations41
DIGITAL EQUIPMENT CORP
2 patentsUS5427878AJun 27, 1995
Semiconductor wafer processing with across-wafer critical dimension monitoring using optical endpoint detection
DIGITAL EQUIPMENT CORP110 citations97
US5280437AJan 18, 1994
Structure and method for direct calibration of registration measurement systems to actual semiconductor wafer process topography
DIGITAL EQUIPMENT CORP28 citations92