Inventor
GOLDFARB DARIO
US24 patents
Patents
24 patentsUS10553522B1Feb 4, 2020
Semiconductor microcooler
IBM20 citations94
US10553516B1Feb 4, 2020
Semiconductor microcooler
IBM10 citations84
US10347486B1Jul 9, 2019
Patterning material film stack with metal-containing top coat for enhanced sensitivity in extreme ultraviolet (EUV) lithography
IBM5 citations83
US10678135B2Jun 9, 2020
Surface treatment of titanium containing hardmasks
IBM2 citations73
US10490480B1Nov 26, 2019
Copper microcooler structure and fabrication
IBM4 citations73
US10490481B1Nov 26, 2019
Copper microcooler structure and fabrication
IBM3 citations73
US11307496B2Apr 19, 2022
Metal brush layer for EUV patterning
IBM2 citations72
US11037786B2Jun 15, 2021
Patterning material film stack with metal-containing top coat for enhanced sensitivity in extreme ultraviolet (EUV) lithography
IBM2 citations72
US10998191B2May 4, 2021
Graded hardmask interlayer for enhanced extreme ultraviolet performance
IBM3 citations72
US7288155B2Oct 30, 2007
Method for the rapid thermal control of a work piece in liquid or supercritical fluid
IBM3 citations63
US12033856B2Jul 9, 2024
Litho-litho-etch (LLE) multi color resist
IBM0 citations62
US12019376B2Jun 25, 2024
Polymer brush adhesion promoter with UV cleavable linker
IBM0 citations62
US11556057B2Jan 17, 2023
Surface treatment of titanium containing hardmasks
IBM0 citations62
US11367617B2Jun 21, 2022
Graded hardmask interlayer for enhanced extreme ultraviolet performance
IBM0 citations62
US11199778B2Dec 14, 2021
Polymer brush adhesion promoter with UV cleavable linker
IBM0 citations62
US11177130B2Nov 16, 2021
Patterning material film stack with metal-containing top coat for enhanced sensitivity in extreme ultraviolet (EUV) lithography
IBM0 citations62
US11056418B2Jul 6, 2021
Semiconductor microcooler
IBM0 citations62
US11049789B2Jun 29, 2021
Semiconductor microcooler
IBM0 citations62
US10831102B2Nov 10, 2020
Photoactive polymer brush materials and EUV patterning using the same
IBM1 citations62
US11906901B2Feb 20, 2024
Alternating copolymer chain scission photoresists
IBM0 citations61
US11462512B2Oct 4, 2022
Three-dimensional microelectronic package with embedded cooling channels
IBM0 citations61
US10937764B2Mar 2, 2021
Three-dimensional microelectronic package with embedded cooling channels
IBM1 citations61
US11500290B2Nov 15, 2022
Adhesion promoters
IBM0 citations52
US10748823B2Aug 18, 2020
Embedded etch rate reference layer for enhanced etch time precision
IBM0 citations52