Inventor
BIH SHIH WEI
TW17 patents
Patents
17 patentsUS10446662B2Oct 15, 2019
Reducing metal gate overhang by forming a top-wide bottom-narrow dummy gate electrode
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations81
US10916517B2Feb 9, 2021
Redistribution layer metallic structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10658315B2May 19, 2020
Redistribution layer metallic structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10354965B2Jul 16, 2019
Bonding pad process with protective layer
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12125783B2Oct 22, 2024
Interconnect structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12040293B2Jul 16, 2024
Redistribution layer metallic structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11664308B2May 30, 2023
Interconnect structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11502050B2Nov 15, 2022
Redistribution layer metallic structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11177365B2Nov 16, 2021
Semiconductor device with adhesion layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11164957B2Nov 2, 2021
Semiconductor device with adhesion layer and method of making
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11081341B2Aug 3, 2021
Apparatus for fabricating a semiconductor device with target sputtering and target sputtering method for fabricating the semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10923416B2Feb 16, 2021
Interconnect structure with insulation layer and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12180576B2Dec 31, 2024
PVD target design and semiconductor devices formed using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12142664B2Nov 12, 2024
Reducing metal gate overhang by forming a top-wide bottom-narrow dummy gate electrode
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11725270B2Aug 15, 2023
PVD target design and semiconductor devices formed using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10490649B2Nov 26, 2019
Method of fabricating semiconductor device with adhesion layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9803274B2Oct 31, 2017
Process kit of physical vapor deposition chamber and fabricating method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48