Inventor
HAGA AKIRA
JP24 patents
⚠️ This page may combine multiple inventors who share the name “HAGA AKIRA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HONDA MOTOR CO LTD
14 patentsUS10604189B2Mar 31, 2020
Vehicle body front part structure
HONDA MOTOR CO LTD4 citations73
US10589789B2Mar 17, 2020
Vehicle body front part structure
HONDA MOTOR CO LTD2 citations73
US10232891B2Mar 19, 2019
Vehicle body structure
HONDA MOTOR CO LTD6 citations72
US9963170B2May 8, 2018
Vehicle front structure
HONDA MOTOR CO LTD2 citations72
US9630656B2Apr 25, 2017
Vehicle body structure
HONDA MOTOR CO LTD3 citations72
US10717469B2Jul 21, 2020
Vehicle body front part structure
HONDA MOTOR CO LTD2 citations71
US9764772B2Sep 19, 2017
Vehicle front body structure
HONDA MOTOR CO LTD2 citations71
US11167805B2Nov 9, 2021
Vehicle front structure
HONDA MOTOR CO LTD0 citations62
US10906586B2Feb 2, 2021
Vehicle body structure
HONDA MOTOR CO LTD1 citations62
US10752296B2Aug 25, 2020
Vehicle body front structure
HONDA MOTOR CO LTD1 citations61
US11180195B2Nov 23, 2021
Lower structure of vehicle
HONDA MOTOR CO LTD0 citations47
US11173964B2Nov 16, 2021
Vehicle body front structure
HONDA MOTOR CO LTD0 citations47
US10668956B2Jun 2, 2020
Vehicle body front structure
HONDA MOTOR CO LTD0 citations46
US10518814B2Dec 31, 2019
Vehicle body front part structure
HONDA MOTOR CO LTD0 citations40
NEC CORP
5 patentsUS5866942AFeb 2, 1999
Metal base package for a semiconductor device
NEC CORP234 citations97
US5844307ADec 1, 1998
Plastic molded IC package with leads having small flatness fluctuation
NEC CORP45 citations92
US5811876ASep 22, 1998
Semiconductor device with film carrier package structure
NEC CORP8 citations73
US5102831AApr 7, 1992
Method of manufacturing multi-chip package
NEC CORP12 citations73
US5783426AJul 21, 1998
Semiconductor device having semiconductor chip mounted in package having cavity and method for fabricating the same
NEC CORP6 citations61