Inventor

STRONG VERONICA

US25 patents

⚠️ This page may combine multiple inventors who share the name “STRONG VERONICA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STRONG VERONICA

INTEL CORP

Heat spreading layer integrated within a composite IC die structure and methods of forming the same

High-density interconnects for integrated circuit packages

Electroless metal-defined thin pad first level interconnects for lithographically defined vias

Electroless metal-defined thin pad first level interconnects for lithographically defined vias

Organic interposers for integrated circuit packages

Dielectric film coating for through glass vias and plane surface roughness mitigation

Inductor with integrated magnetics

Wideband antennas in glass through direct via feeding and glass stacking

Glass vias and planes with reduced tapering

Physical vapor deposition seeding for high aspect ratio vias in glass core technology

Compact surface transmission line waveguides with vertical ground planes

RF filters and multiplexers manufactured in the core of a package substrate using glass core technology

Package substrate with glass core having vertical power planes for improved power delivery

Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrate

High-density interconnects for integrated circuit packages

Zero-misalignment two-via structures

Interconnection structure fabrication using grayscale lithography

Heat spreading layer integrated within a composite IC die structure and methods of forming the same

Zero-misalignment two-via structures

Interconnection structure fabrication using grayscale lithography

Zero-misalignment two-via structures using photoimageable dielectric, buildup film, and electrolytic plating

Zero-misalignment two-via structures using photoimageable dielectric film buildup film, and transparent substrate with electroless plating

Dual sided thermal management solutions for integrated circuit packages

UNIV CALIFORNIA

Interconnected corrugated carbon-based network

Interconnected corrugated carbon-based network