Inventor
RAWLINGS BRANDON
US14 patents
Patents
14 patentsUS11133263B2Sep 28, 2021
High-density interconnects for integrated circuit packages
INTEL CORP6 citations83
US11394094B2Jul 19, 2022
Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements
INTEL CORP2 citations73
US10998272B2May 4, 2021
Organic interposers for integrated circuit packages
INTEL CORP2 citations72
US12598997B2Apr 7, 2026
Inductor with integrated magnetics
INTEL CORP0 citations62
US12573744B2Mar 10, 2026
Wideband antennas in glass through direct via feeding and glass stacking
INTEL CORP0 citations62
US12525496B2Jan 13, 2026
Glass vias and planes with reduced tapering
INTEL CORP0 citations62
US12205902B2Jan 21, 2025
High-density interconnects for integrated circuit packages
INTEL CORP0 citations62
US11694951B2Jul 4, 2023
Zero-misalignment two-via structures
INTEL CORP0 citations62
US11664303B2May 30, 2023
Interconnection structure fabrication using grayscale lithography
INTEL CORP0 citations62
US11222836B2Jan 11, 2022
Zero-misalignment two-via structures
INTEL CORP0 citations62
US11101205B2Aug 24, 2021
Interconnection structure fabrication using grayscale lithography
INTEL CORP0 citations62
US11502037B2Nov 15, 2022
Zero-misalignment two-via structures using photoimageable dielectric, buildup film, and electrolytic plating
INTEL CORP0 citations61
US11328996B2May 10, 2022
Zero-misalignment two-via structures using photoimageable dielectric film buildup film, and transparent substrate with electroless plating
INTEL CORP0 citations61
US11460499B2Oct 4, 2022
Dual sided thermal management solutions for integrated circuit packages
INTEL CORP0 citations51