Inventor
KARIM ISHTAK
US30 patents
⚠️ This page may combine multiple inventors who share the name “KARIM ISHTAK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
29 patentsUS10074543B2Sep 11, 2018
High dry etch rate materials for semiconductor patterning applications
LAM RES CORP33 citations94
US10037884B2Jul 31, 2018
Selective atomic layer deposition for gapfill using sacrificial underlayer
LAM RES CORP30 citations94
US9738977B1Aug 22, 2017
Showerhead curtain gas method and system for film profile modulation
LAM RES CORP26 citations94
US9644271B1May 9, 2017
Systems and methods for using electrical asymmetry effect to control plasma process space in semiconductor fabrication
LAM RES CORP21 citations93
US10062563B2Aug 28, 2018
Selective atomic layer deposition with post-dose treatment
LAM RES CORP16 citations92
US10679848B2Jun 9, 2020
Selective atomic layer deposition with post-dose treatment
LAM RES CORP10 citations84
US10655224B2May 19, 2020
Conical wafer centering and holding device for semiconductor processing
LAM RES CORP8 citations84
US10202691B2Feb 12, 2019
Showerhead curtain gas method and system for film profile modulation
LAM RES CORP8 citations84
US10128160B2Nov 13, 2018
Systems and methods for detection of plasma instability by electrical measurement
LAM RES CORP6 citations84
US10094018B2Oct 9, 2018
Dynamic precursor dosing for atomic layer deposition
LAM RES CORP7 citations84
US9870917B2Jan 16, 2018
Variable temperature hardware and methods for reduction of wafer backside deposition
LAM RES CORP10 citations84
US9824941B2Nov 21, 2017
Systems and methods for detection of plasma instability by electrical measurement
LAM RES CORP3 citations84
US9478411B2Oct 25, 2016
Method to tune TiOx stoichiometry using atomic layer deposited Ti film to minimize contact resistance for TiOx/Ti based MIS contact scheme for CMOS
LAM RES CORP7 citations84
US11180850B2Nov 23, 2021
Dynamic precursor dosing for atomic layer deposition
LAM RES CORP3 citations73
US9997422B2Jun 12, 2018
Systems and methods for frequency modulation of radiofrequency power supply for controlling plasma instability
LAM RES CORP2 citations73
US9478438B2Oct 25, 2016
Method and apparatus to deposit pure titanium thin film at low temperature using titanium tetraiodide precursor
LAM RES CORP5 citations73
US10622243B2Apr 14, 2020
Planar substrate edge contact with open volume equalization pathways and side containment
LAM RES CORP2 citations72
US12448687B2Oct 21, 2025
Dynamic precursor dosing for atomic layer deposition
LAM RES CORP0 citations62
US11970772B2Apr 30, 2024
Dynamic precursor dosing for atomic layer deposition
LAM RES CORP1 citations62
US11651963B2May 16, 2023
Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based film
LAM RES CORP0 citations62
US11443975B2Sep 13, 2022
Planar substrate edge contact with open volume equalization pathways and side containment
LAM RES CORP0 citations62
US10978302B2Apr 13, 2021
Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based film
LAM RES CORP0 citations62
US12274047B2Apr 8, 2025
Line bending control for memory applications
LAM RES CORP0 citations60
US11864372B2Jan 2, 2024
Line bending control for memory applications
LAM RES CORP1 citations60
US10340136B1Jul 2, 2019
Minimization of carbon loss in ALD SiO2 deposition on hardmask films
LAM RES CORP1 citations60
US12077859B2Sep 3, 2024
Variable cycle and time RF activation method for film thickness matching in a multi-station deposition system
LAM RES CORP1 citations56
US9941113B2Apr 10, 2018
Systems and methods for using electrical asymmetry effect to control plasma process space in semiconductor fabrication
LAM RES CORP0 citations51
US12142509B2Nov 12, 2024
Electrostatic chuck with seal surface
LAM RES CORP0 citations50
US10692717B2Jun 23, 2020
Minimization of carbon loss in ALD SiO2 deposition on hardmask films
LAM RES CORP0 citations50