Inventor
BALOGLU BORA
US31 patents
⚠️ This page may combine multiple inventors who share the name “BALOGLU BORA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
14 patentsUS10410999B2Sep 10, 2019
Semiconductor device with integrated heat distribution and manufacturing method thereof
AMKOR TECHNOLOGY INC14 citations93
US9559075B1Jan 31, 2017
Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
AMKOR TECHNOLOGY INC20 citations92
US9905440B1Feb 27, 2018
Method of manufacturing an electronic device and electronic device manufactured thereby
AMKOR TECHNOLOGY INC8 citations84
US9607890B1Mar 28, 2017
Stress relieving through-silicon vias
AMKOR TECHNOLOGY INC9 citations84
US10504827B2Dec 10, 2019
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC6 citations83
US10468272B2Nov 5, 2019
Method of manufacturing an electronic device and electronic device manufactured thereby
AMKOR TECHNOLOGY INC2 citations73
US10438910B2Oct 8, 2019
Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
AMKOR TECHNOLOGY INC2 citations72
US10032726B1Jul 24, 2018
Embedded vibration management system
AMKOR TECHNOLOGY INC2 citations72
US11352252B2Jun 7, 2022
Semiconductor device and method of manufacturing semiconductor device
AMKOR TECHNOLOGY INC0 citations59
US10790161B2Sep 29, 2020
Electronic device with adaptive vertical interconnect and fabricating method thereof
AMKOR TECHNOLOGY INC0 citations52
US10134635B1Nov 20, 2018
Stress relieving through-silicon vias
AMKOR TECHNOLOGY INC1 citations52
US10861798B2Dec 8, 2020
Embedded vibration management system having an array of vibration absorbing structures
AMKOR TECHNOLOGY INC0 citations51
US10062611B2Aug 28, 2018
Encapsulated semiconductor package and method of manufacturing thereof
AMKOR TECHNOLOGY INC0 citations51
US9741617B2Aug 22, 2017
Encapsulated semiconductor package and method of manufacturing thereof
AMKOR TECHNOLOGY INC1 citations51
AMKOR TECH SINGAPORE HOLDING PTE LTD
13 patentsUS11823913B2Nov 21, 2023
Method of manufacturing an electronic device and electronic device manufactured thereby
AMKOR TECH SINGAPORE HOLDING PTE LTD1 citations73
US11031259B2Jun 8, 2021
Method of manufacturing an electronic device and electronic device manufactured thereby
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations73
US11901343B2Feb 13, 2024
Semiconductor device with integrated heat distribution and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD1 citations72
US11444013B2Sep 13, 2022
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations72
US12581970B2Mar 17, 2026
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US12015000B2Jun 18, 2024
Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11018102B2May 25, 2021
Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US10985146B2Apr 20, 2021
Semiconductor device with integrated heat distribution and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11784101B2Oct 10, 2023
Semiconductor devices comprising a lid structure and methods of manufacturing semiconductor devices comprising a lid structure
AMKOR TECH SINGAPORE HOLDING PTE LTD1 citations61
US12221339B2Feb 11, 2025
Semiconductor device and method of manufacturing semiconductor device
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations59
US11897761B2Feb 13, 2024
Semiconductor device and method of manufacturing semiconductor device
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations59
US11605552B2Mar 14, 2023
Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations57
US11915949B2Feb 27, 2024
Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations53
BALOGLU BORA
4 patentsUS8986806B1Mar 24, 2015
Warpage control stiffener ring package and fabrication method
BALOGLU BORA35 citations92
US9349613B1May 24, 2016
Electronic package with embedded materials in a molded structure to control warpage and stress
BALOGLU BORA3 citations69
US9269872B1Feb 23, 2016
Molded electronic package geometry to control warpage and die stress
BALOGLU BORA2 citations58
US8940587B1Jan 27, 2015
Die seal design and method and apparatus for integrated circuit production
BALOGLU BORA1 citations51