Inventor
HUEMOELLER RONALD
US30 patents
⚠️ This page may combine multiple inventors who share the name “HUEMOELLER RONALD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
17 patentsUS9653428B1May 16, 2017
Semiconductor package and fabricating method thereof
AMKOR TECHNOLOGY INC132 citations98
US9543242B1Jan 10, 2017
Semiconductor package and fabricating method thereof
AMKOR TECHNOLOGY INC73 citations97
US10192816B2Jan 29, 2019
Semiconductor package and fabricating method thereof
AMKOR TECHNOLOGY INC15 citations94
US10943858B2Mar 9, 2021
Semiconductor package and fabricating method thereof
AMKOR TECHNOLOGY INC5 citations84
US10497674B2Dec 3, 2019
Semiconductor package and fabricating method thereof
AMKOR TECHNOLOGY INC6 citations84
US10312220B2Jun 4, 2019
Semiconductor package and fabricating method thereof
AMKOR TECHNOLOGY INC12 citations84
US9905440B1Feb 27, 2018
Method of manufacturing an electronic device and electronic device manufactured thereby
AMKOR TECHNOLOGY INC8 citations84
US9852976B2Dec 26, 2017
Semiconductor package and fabricating method thereof
AMKOR TECHNOLOGY INC6 citations84
US9437575B1Sep 6, 2016
Semiconductor device package formed in a chip-on-wafer last process using thin film adhesives
AMKOR TECHNOLOGY INC8 citations84
US9818684B2Nov 14, 2017
Electronic device with a plurality of redistribution structures having different respective sizes
AMKOR TECHNOLOGY INC11 citations80
US10784232B2Sep 22, 2020
Semiconductor package and fabricating method thereof
AMKOR TECHNOLOGY INC4 citations73
US10468272B2Nov 5, 2019
Method of manufacturing an electronic device and electronic device manufactured thereby
AMKOR TECHNOLOGY INC2 citations73
US10032748B2Jul 24, 2018
Semiconductor package and fabricating method thereof
AMKOR TECHNOLOGY INC4 citations73
US10790161B2Sep 29, 2020
Electronic device with adaptive vertical interconnect and fabricating method thereof
AMKOR TECHNOLOGY INC0 citations52
US10504871B2Dec 10, 2019
Semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC0 citations52
US9627353B2Apr 18, 2017
Method of manufacturing a semiconductor package
AMKOR TECHNOLOGY INC0 citations52
US10818602B2Oct 27, 2020
Embedded ball land substrate, semiconductor package, and manufacturing methods
AMKOR TECHNOLOGY INC0 citations49
AMKOR TECH SINGAPORE HOLDING PTE LTD
11 patentsUS11823913B2Nov 21, 2023
Method of manufacturing an electronic device and electronic device manufactured thereby
AMKOR TECH SINGAPORE HOLDING PTE LTD1 citations73
US11652038B2May 16, 2023
Semiconductor package with front side and back side redistribution structures and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations73
US11244923B2Feb 8, 2022
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations73
US11031259B2Jun 8, 2021
Method of manufacturing an electronic device and electronic device manufactured thereby
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations73
US12159823B2Dec 3, 2024
Semiconductor package with front side and back side redistribution structures and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11881471B2Jan 23, 2024
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11335643B2May 17, 2022
Embedded ball land substrate, semiconductor package, and manufacturing methods
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations59
US11605552B2Mar 14, 2023
Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations57
US11915949B2Feb 27, 2024
Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations53
US12588560B2Mar 24, 2026
Semiconductor package and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations50
US11676941B2Jun 13, 2023
Semiconductor package and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations50
APPLIED MATERIALS INC
2 patentsUS12487417B2Dec 2, 2025
Photonic glass layer substrate with embedded optical structures for communicating with an electro optical integrated circuit
APPLIED MATERIALS INC0 citations51
US12345934B2Jul 1, 2025
Methods for fabrication of optical structures on photonic glass layer substrates
APPLIED MATERIALS INC0 citations51