Inventor

LO CHIUNG C

US41 patents

⚠️ This page may combine multiple inventors who share the name “LO CHIUNG C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LO CHIUNG C

XMEMS LABS INC

Sound producing device

Acoustic transducer, wearable sound device and manufacturing method of acoustic transducer

Acoustic transducer, wearable sound device and manufacturing method of acoustic transducer

Air pulse generating element and sound producing device

Driving circuit and wearable sound device thereof

Device, package structure and manufacturing method of device

Air pulse generating element and manufacturing method thereof

Sound producing cell and manufacturing method thereof

Sound producing package structure including sound producing membranes actuated toward cavity center

Sound producing device

Sound producing device

Manufacturing method of device

Sound producing device

Sound producing cell

Venting device, manufacturing method of venting device, venting method and device

Venting device and venting method thereof

Sound producing cell and manufacturing method thereof

Sound producing package structure and manufacturing method thereof

Acoustic impedance measuring system and acoustic impedance measuring method

Sound producing cell and manufacturing method thereof

Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus

Acoustic testing method and acoustic testing system thereof

Electronic device and airflow generating package

Venting device

Acoustic device and holder flattening frequency response

Method for manufacturing air pulse generating element

Acoustic package structure and covering structure

Sound producing package structure and method for packaging sound producing package structure

Crossover circuit

Air pulse generating element and sound producing device

LO CHIUNG C

Micromachined magnetic field sensors

Wafer-level packaged device having self-assembled resilient leads

SEEGER JOSEPH

Micromachined resonant magnetic field sensors

Micromachined resonant magnetic field sensors

MAXIM INTEGRATED PRODUCTS

Wafer-level packaged device having self-assembled resilient leads

Wafer-level packaged device having self-assembled resilient leads

SHAEFFER DEREK

Integrated MEMS device and method of use

PARVARANDEH PIROOZ

Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress

SAMOILOV ARKADII V

Light sensor using wafer-level packaging

KANG YU-FU

Micro-electro-mechanical system (MEMS) chip

XMEMS TAIWAN CO LTD

Sound producing package structure and manufacturing method thereof