Inventor
LEE CHANGBO
KR10 patents
⚠️ This page may combine multiple inventors who share the name “LEE CHANGBO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
8 patentsUS11121090B2Sep 14, 2021
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations68
US12550759B2Feb 10, 2026
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations58
US11694965B2Jul 4, 2023
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations58
US11462466B2Oct 4, 2022
Fan-out type semiconductor packages and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations57
US12199060B2Jan 14, 2025
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations56
US11682648B2Jun 20, 2023
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations56
US12237252B2Feb 25, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations53
US12575398B2Mar 10, 2026
Interconnection structure and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations47