Inventor
LONG GREG SCOTT
US23 patents
⚠️ This page may combine multiple inventors who share the name “LONG GREG SCOTT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
12 patentsUS12121973B2Oct 22, 2024
Three-dimensional (3D) printing
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11760012B2Sep 19, 2023
Three-dimensional printing with carbamide-containing compound
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11633782B2Apr 25, 2023
Three-dimensional (3D) printing
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11009383B2May 18, 2021
Fluid property sensing with electrodes
HEWLETT PACKARD DEVELOPMENT CO0 citations62
US11318537B2May 3, 2022
Microwave sensing in additive manufacturing
HEWLETT PACKARD DEVELOPMENT CO0 citations60
US11440247B2Sep 13, 2022
Additive manufacturing object conductivity
HEWLETT PACKARD DEVELOPMENT CO0 citations57
US11279129B2Mar 22, 2022
Amorphous thin metal film
HEWLETT PACKARD DEVELOPMENT CO0 citations56
US10676806B2Jun 9, 2020
Wear resistant coating
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US10641727B2May 5, 2020
Electrochemical sensing well
HEWLETT PACKARD DEVELOPMENT CO0 citations49
US10359392B2Jul 23, 2019
Electrochemical sensing well
HEWLETT PACKARD DEVELOPMENT CO0 citations49
US10449763B2Oct 22, 2019
Amorphous thin metal film
HEWLETT PACKARD DEVELOPMENT CO0 citations47
US11465360B2Oct 11, 2022
Additive manufactured resistivity
HEWLETT PACKARD DEVELOPMENT CO0 citations46
HEWLETT PACKARD ENTPR DEV LP
3 patentsUS10874035B2Dec 22, 2020
Identifying cooling loop characteristics
HEWLETT PACKARD ENTPR DEV LP3 citations73
US10871481B2Dec 22, 2020
Sensors for cooling system fluid attributes
HEWLETT PACKARD ENTPR DEV LP1 citations60
US12227433B2Feb 18, 2025
Electrical frequency response fluid analysis
HEWLETT PACKARD ENTPR DEV LP0 citations57
HEWLETT PACKARD DEVELOPMENT CO LP
3 patentsUS9469107B2Oct 18, 2016
Thermal inkjet printhead stack with amorphous metal resistor
HEWLETT PACKARD DEVELOPMENT CO LP3 citations71
US9511585B2Dec 6, 2016
Thermal inkjet printhead stack with amorphous thin metal protective layer
HEWLETT PACKARD DEVELOPMENT CO LP3 citations70
US9557288B2Jan 31, 2017
Electrochemical sensing well
HEWLETT PACKARD DEVELOPMENT CO LP1 citations60
PERIDOT PRINT LLC
3 patentsUS12570049B2Mar 10, 2026
Reducing surface roughness of cured three-dimensional printed objects using a localized heat source
PERIDOT PRINT LLC0 citations61
US12448538B2Oct 21, 2025
Three-dimensional printing kits
PERIDOT PRINT LLC0 citations61
US12454097B2Oct 28, 2025
Three-dimensional printing with polyamides and cubic lattice structured particles
PERIDOT PRINT LLC0 citations60