Inventor
MENG CHING LING
US32 patents
⚠️ This page may combine multiple inventors who share the name “MENG CHING LING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO ELECTRON LTD
19 patentsUS10345246B2Jul 9, 2019
Dark field wafer nano-defect inspection system with a singular beam
TOKYO ELECTRON LTD20 citations94
US7595869B1Sep 29, 2009
Optical metrology system optimized with a plurality of design goals
TOKYO ELECTRON LTD24 citations92
US7761250B2Jul 20, 2010
Optical metrology system optimized with design goals
TOKYO ELECTRON LTD12 citations84
US7761178B2Jul 20, 2010
Automated process control using an optical metrology system optimized with design goals
TOKYO ELECTRON LTD16 citations84
US7742889B2Jun 22, 2010
Designing an optical metrology system optimized with signal criteria
TOKYO ELECTRON LTD9 citations82
US7734437B2Jun 8, 2010
Apparatus for designing an optical metrology system optimized with signal criteria
TOKYO ELECTRON LTD12 citations82
US7589845B1Sep 15, 2009
Process control using an optical metrology system optimized with signal criteria
TOKYO ELECTRON LTD16 citations82
US10978278B2Apr 13, 2021
Normal-incident in-situ process monitor sensor
TOKYO ELECTRON LTD2 citations73
US10473525B2Nov 12, 2019
Spatially resolved optical emission spectroscopy (OES) in plasma processing
TOKYO ELECTRON LTD6 citations72
US9970818B2May 15, 2018
Spatially resolved optical emission spectroscopy (OES) in plasma processing
TOKYO ELECTRON LTD5 citations72
US10692705B2Jun 23, 2020
Advanced optical sensor and method for detecting an optical event in a light emission signal in a plasma chamber
TOKYO ELECTRON LTD5 citations71
US9059038B2Jun 16, 2015
System for in-situ film stack measurement during etching and etch control method
TOKYO ELECTRON LTD5 citations71
US9846088B2Dec 19, 2017
Differential acoustic time of flight measurement of temperature of semiconductor substrates
TOKYO ELECTRON LTD2 citations69
US12261030B2Mar 25, 2025
Normal-incidence in-situ process monitor sensor
TOKYO ELECTRON LTD0 citations62
US11961721B2Apr 16, 2024
Normal-incidence in-situ process monitor sensor
TOKYO ELECTRON LTD0 citations62
US11385154B2Jul 12, 2022
Apparatus and method for monitoring and measuring properties of polymers in solutions
TOKYO ELECTRON LTD1 citations62
US7789541B2Sep 7, 2010
Method and system for lamp temperature control in optical metrology
TOKYO ELECTRON LTD2 citations62
US10837902B2Nov 17, 2020
Optical sensor for phase determination
TOKYO ELECTRON LTD1 citations59
US12588467B2Mar 24, 2026
Optical sensors for measuring properties of consumable parts in a semiconductor plasma processing chamber
TOKYO ELECTRON LTD0 citations49
KLA TENCOR TECH CORP
8 patentsUS8010222B2Aug 30, 2011
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
KLA TENCOR TECH CORP29 citations96
US6884146B2Apr 26, 2005
Systems and methods for characterizing a polishing process
KLA TENCOR TECH CORP24 citations96
US7332438B2Feb 19, 2008
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
KLA TENCOR TECH CORP11 citations92
US7175503B2Feb 13, 2007
Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device
KLA TENCOR TECH CORP11 citations92
US7030018B2Apr 18, 2006
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
KLA TENCOR TECH CORP14 citations92
US6935922B2Aug 30, 2005
Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing
KLA TENCOR TECH CORP16 citations92
US7420681B1Sep 2, 2008
Gas purge system and methods
KLA TENCOR TECH CORP22 citations89
US7052369B2May 30, 2006
Methods and systems for detecting a presence of blobs on a specimen during a polishing process
KLA TENCOR TECH CORP10 citations82