Inventor

COLGAN EVAN GEORGE

US56 patents

⚠️ This page may combine multiple inventors who share the name “COLGAN EVAN GEORGE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

COLGAN EVAN GEORGE

IBM

Method and apparatus of water cooling several parallel circuit cards each containing several chip packages

Touch screen stylus with IR-coupled selection buttons

Integrated resistor for measuring touch position in a liquid crystal display device

Liquid crystal display device employing a guard plane between a layer for measuring touch position and common electrode layer

Liquid crystal display device employing a guard plane between a layer for measuring touch position and common electrode layer

Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages

Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages

Method of forming ohmic contacts using a self doping layer for thin-film transistors

Liquid crystal display device

Reflective spatial light modulator array

Devices and methods for side-coupling optical fibers to optoelectronic components

Electroplating apparatus

Thin film multi-layer oxygen diffusion barrier consisting of aluminum on refractory metal

Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements

Devices and methods for side-coupling optical fibers to optoelectronic components

Apparatus and methods for cooling semiconductor integrated circuit package structures

Devices and methods for side-coupling optical fibers to optoelectronic components

Direct view display with lenticular lens for improved brightness and wide viewing angle

Chip cooling

Method of bonding optical fibers and optical fiber assembly

LCD cell construction by mechanical thinning of a color filter substrate

Low resistance wiring in the periphery region of displays

Reflective spatial light modulator array

Method of forming fully self-aligned TFT with improved process window

Interconnect structure using Al2 Cu for an integrated circuit chip

Interconnect structure using Al2 -Cu for an integrated circuit chip

Apparatus and methods for cooling semiconductor integrated circuit package structures

Space transforming land grid array interposers

Apparatus and methods for cooling semiconductor integrated circuit package structures

Electronic package structures using land grid array interposers for module-to-board interconnection

Pixel capacitor formed from multiple layers

Devices and methods for side-coupling optical fibers to optoelectronic components

Tool and method for increasing liquid crystal fill rates of flat panel in which a sealed edge is compressed

Liquid crystal light valve and method for producing same, and liquid crystal projection display device

Chip package for two-phase cooling and assembly process thereof

Cooling system for electronic components

Reflective spatial light modulator array including a light blocking layer

Electroplating apparatus and four mask TFT array process with electroplated metal

Method of alignment between sheet materials, method of alignment, substrate assembling method and aligning apparatus

Method of forming fully self-aligned TFT improved process window

Underfill dispensing using funnels

Apparatus and methods for cooling semiconductor integrated circuit package structures

Alignment of lenticular sheets

Modification of in-plate refractory metal texture by use of refractory metal/nitride layer

BEZAMA RASCHID JOSE

Semiconductor package structures having liquid coolers integrated with first level chip package modules

Semiconductor package structures having liquid cooler integrated with first level chip package modules

Stacked and redundant chip coolers

Structure and apparatus for cooling integrated circuits using copper microchannels

Structure and apparatus for cooling integrated circuits using cooper microchannels

CIPOLLA THOMAS M

Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages