Inventor
HULTMARK ERIC B
US8 patents
Patents
8 patentsUS6232667B1May 15, 2001
Technique for underfilling stacked chips on a cavity MLC module
IBM52 citations93
US4771366ASep 13, 1988
Ceramic card assembly having enhanced power distribution and cooling
IBM106 citations91
US6332946B1Dec 25, 2001
Method for assembling a multi-layered ceramic package
IBM41 citations89
US6112795ASep 5, 2000
Fixture for multi-layered ceramic package assembly
IBM22 citations89
US4546405AOct 8, 1985
Heat sink for electronic package
IBM45 citations86
US6599774B2Jul 29, 2003
Technique for underfilling stacked chips on a cavity MLC module
IBM13 citations81
US6049456AApr 11, 2000
Electronic module adjustment design and process using shims
IBM12 citations73
USD304715SNov 21, 1989
Heat sink or similar article
IBM7 citations72