Inventor
ASAHINA MICHIO
JP20 patents
Patents
20 patentsUS6723628B2Apr 20, 2004
Method for forming bonding pad structures in semiconductor devices
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US6511910B2Jan 28, 2003
Method for manufacturing semiconductor devices
SEIKO EPSON CORP34 citations92
US6429493B1Aug 6, 2002
Semiconductor device and method for manufacturing semiconductor device
SEIKO EPSON CORP29 citations92
US6350685B1Feb 26, 2002
Method for manufacturing semiconductor devices
SEIKO EPSON CORP48 citations92
US6326287B1Dec 4, 2001
Semiconductor device and method of fabricating the same
SEIKO EPSON CORP50 citations92
US6194304B1Feb 27, 2001
Semiconductor device and method of fabricating the same
SEIKO EPSON CORP36 citations92
US6144097ANov 7, 2000
Semiconductor device and method of fabricating the same
SEIKO EPSON CORP33 citations92
US6107182AAug 22, 2000
Semiconductor device and method of fabricating the same
SEIKO EPSON CORP31 citations92
US5342806AAug 30, 1994
Method for fabricating a semiconductor device having a conductor structure with a plated layer
SEIKO EPSON CORP40 citations92
US4826781AMay 2, 1989
Semiconductor device and method of preparation
SEIKO EPSON CORP36 citations92
US6614119B1Sep 2, 2003
Semiconductor device and method of fabricating the same
SEIKO EPSON CORP15 citations84
US6137176AOct 24, 2000
Semiconductor device and method of fabricating the same
SEIKO EPSON CORP15 citations82
US7091609B2Aug 15, 2006
Semiconductor devices including an alloy layer and a wetting layer on an interlayer dielectric
SEIKO EPSON CORP5 citations74
US5190886AMar 2, 1993
Semiconductor device and method of production
SEIKO EPSON CORP15 citations74
US5093276AMar 3, 1992
Semiconductor device and method of production
SEIKO EPSON CORP6 citations74
US5086006AFeb 4, 1992
Semiconductor device and method of production
SEIKO EPSON CORP8 citations74
US4985746AJan 15, 1991
Semiconductor device and method of production
SEIKO EPSON CORP13 citations74
US6812123B2Nov 2, 2004
Semiconductor devices and methods for manufacturing the same
SEIKO EPSON CORP3 citations63
US6458703B2Oct 1, 2002
Method for manufacturing semiconductor devices with allevration of thermal stress generation in conductive coating
SEIKO EPSON CORP5 citations63
US6486555B2Nov 26, 2002
Semiconductor device having a contact structure using aluminum
SEIKO EPSON CORP5 citations62