Inventor

TAMAI SHOJI

JP68 patents

⚠️ This page may combine multiple inventors who share the name “TAMAI SHOJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAMAI SHOJI

MITSUI TOATSU CHEMICALS

Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines

Flexible laminate printed-circuit board and methods of making same

Linear polyamic acid, linear polyimide and thermoset polyimide

Polyimide from ether diamine having the indane structure and high-temperature adhesive of polyimide

Process for preparing polycondensation polymer compound

Polyimide

Polyimide and high-temperature adhesive of polyimide

Process for preparing a polyimide and a composite material containing the same

Polyimide and high-temperature adhesive thereof

Flexible copper-clad circuit substrate

Production process for polyimide fibers

Polyimides, process for the preparation thereof and polyimide resin compositions

Readily processable polyimide and preparation process of same

High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phenoxy)phenyl]1,1,1,3,3,3-hexafluoro propane

Heat-resistant adhesive and method of adhesion by using adhesive

Polyimide

Resin forming compositions

Polyimide

Polyimides, process for the preparation thereof and polyimide resin compositions

Polyimides, process for the preparation thereof and polyimide resin compositions

Formed polyimide article

Heat-resistant adhesive

Thermally stable polyimide and preparation process of polyimide

Readily processable polyimide and preparation process of same

Preparation process of polyimide

Polyimide and high-temperature adhesive of polyimide

Polymide

Polyimide resin composition

Thermosetting resin from penta arylene bis maleimide

Polyimide and high-temperature adhesive of polyimide based on meta-phenoxy diamines

Polyimide resin composition

Process for preparing polyimide having excellent high temperature stability

Polyimide/polyamideimide resin composition

Polymide for high-temperature adhesive

High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy)pyridine

Bismaleimide compounds

Readily soluble, amorphous polyimide, and preparation process of same

Polyimide and process for the preparation thereof

Aromatic diamine compound, preparation process of same and polyimide prepared from same

Aromatic diamine compounds, bismaleimide compounds, thermosetting resin forming compositions therefrom, resins therefrom, and methods for their preparation

MITSUI CHEMICALS INC

Polyimide containing crosslinkable group and process for producing the same

Crystalline polyimide for melt molding with satisfactory thermal stability

Process for producing polyimide

Crosslinkable aromatic resin having protonic acid group, and ion conductive polymer membrane, binder and fuel cell using the resin

Polyimides and polyamic acids

Liquid crystal polyamide-imide copolymer

Magnetic core and magnetic core-use adhesive resin composition

Polyimide resin compositions for optical filters

Polyimide resin compositions for optical filters

AMDAHL CORP

Process for preparing polyimides