Inventor

YOKOZAWA MASAMI

JP10 patents

⚠️ This page may combine multiple inventors who share the name “YOKOZAWA MASAMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MATSUSHITA ELECTRONICS CORP

7 patents

US4451973AJun 5, 1984

Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor

MATSUSHITA ELECTRONICS CORP97 citations94

US6215174B1Apr 10, 2001

Lead frame, mold for producing a resin-sealed semiconductor device, resin-sealed semiconductor device using such a lead frame

MATSUSHITA ELECTRONICS CORP18 citations92

US4589010AMay 13, 1986

Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor

MATSUSHITA ELECTRONICS CORP30 citations90

US5298793AMar 29, 1994

Semiconductor device including an electrode

MATSUSHITA ELECTRONICS CORP50 citations88

US4482915ANov 13, 1984

Lead frame for plastic encapsulated semiconductor device

MATSUSHITA ELECTRONICS CORP20 citations81

US4503452AMar 5, 1985

Plastic encapsulated semiconductor device and method for manufacturing the same

MATSUSHITA ELECTRONICS CORP21 citations78

US6335223B1Jan 1, 2002

Method for producing a resin-sealed semiconductor device

MATSUSHITA ELECTRONICS CORP10 citations73

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

3 patents

US6187114B1Feb 13, 2001

Solder material and electronic part using the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD33 citations86

US5629551AMay 13, 1997

Semiconductor device comprising an over-temperature detection element for detecting excessive temperatures amplifiers

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD11 citations68

US5461252AOct 24, 1995

Semiconductor device comprising an over-temperature detection element for detecting excessive temperature of amplifiers

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD7 citations68