Inventor
FEIGENBAUM HAIM
US39 patents
⚠️ This page may combine multiple inventors who share the name “FEIGENBAUM HAIM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HUGHES AIRCRAFT CO
10 patentsUS5354205AOct 11, 1994
Electrical connections with shaped contacts
HUGHES AIRCRAFT CO131 citations99
US5326412AJul 5, 1994
Method for electrodepositing corrosion barrier on isolated circuitry
HUGHES AIRCRAFT CO92 citations96
US5307561AMay 3, 1994
Method for making 3-D electrical circuitry
HUGHES AIRCRAFT CO61 citations96
US5378982AJan 3, 1995
Test probe for panel having an overlying protective member adjacent panel contacts
HUGHES AIRCRAFT CO31 citations92
US5364277ANov 15, 1994
Three-dimensional electroformed circuitry
HUGHES AIRCRAFT CO28 citations92
US5245750ASep 21, 1993
Method of connecting a spaced ic chip to a conductor and the article thereby obtained
HUGHES AIRCRAFT CO36 citations92
US5197184AMar 30, 1993
Method of forming three-dimensional circuitry
HUGHES AIRCRAFT CO38 citations92
US5435733AJul 25, 1995
Connector assembly for microelectronic multi-chip-module
HUGHES AIRCRAFT CO38 citations90
US5306546AApr 26, 1994
Multi chip module substrate
HUGHES AIRCRAFT CO17 citations72
US5158466AOct 27, 1992
Metallically encapsulated elevated interconnection feature
HUGHES AIRCRAFT CO10 citations72
PACKARD HUGHES INTERCONNECT CO
7 patentsUS5946555AAug 31, 1999
Wafer level decal for minimal packaging of chips
PACKARD HUGHES INTERCONNECT CO57 citations96
US6166333ADec 26, 2000
Bumps with plural under-bump dielectric layers
PACKARD HUGHES INTERCONNECT CO47 citations92
US5896271AApr 20, 1999
Integrated circuit with a chip on dot and a heat sink
PACKARD HUGHES INTERCONNECT CO44 citations92
US5924193AJul 20, 1999
Method of making mandrels and circuits therefrom
PACKARD HUGHES INTERCONNECT CO21 citations88
US5708557AJan 13, 1998
Puncture-resistant electrostatic chuck with flat surface and method of making the same
PACKARD HUGHES INTERCONNECT CO23 citations87
US6007669ADec 28, 1999
Layer to layer interconnect
PACKARD HUGHES INTERCONNECT CO19 citations79
US5777484AJul 7, 1998
Device for testing integrated circuit chips during vibration
PACKARD HUGHES INTERCONNECT CO12 citations73
ENGELHARD CORP
7 patentsUS4467019AAug 21, 1984
Fuel cell with electrolyte feed system
ENGELHARD CORP27 citations92
US4463067AJul 31, 1984
Fuel cell and system for supplying electrolyte thereto utilizing cascade feed
ENGELHARD CORP27 citations92
US4463066AJul 31, 1984
Fuel cell and system for supplying electrolyte thereto
ENGELHARD CORP29 citations92
US4728533AMar 1, 1988
Process for forming integral edge seals in porous gas distribution plates utilizing a vibratory means
ENGELHARD CORP39 citations91
US4463068AJul 31, 1984
Fuel cell and system for supplying electrolyte thereto with wick feed
ENGELHARD CORP42 citations89
US4450212AMay 22, 1984
Edge seal for a porous gas distribution plate of a fuel cell
ENGELHARD CORP29 citations87
US4605602AAug 12, 1986
Corrosion protected, multi-layer fuel cell interface
ENGELHARD CORP18 citations70
TESLA INC
7 patentsUS11888108B2Jan 30, 2024
Prelithiated hybridized energy storage device
TESLA INC2 citations73
US11876230B2Jan 16, 2024
Dry energy storage device electrode and methods of making the same
TESLA INC1 citations73
US11637289B2Apr 25, 2023
Compositions and methods for parallel processing of electrode film mixtures
TESLA INC2 citations72
US12406995B2Sep 2, 2025
Dry energy storage device electrode and methods of making the same
TESLA INC0 citations62
US12374692B2Jul 29, 2025
Compositions and methods for parallel processing of electrode film mixtures
TESLA INC0 citations62
US12230798B2Feb 18, 2025
Compositions and methods for silicon containing dry anode films
TESLA INC0 citations62
US12218303B2Feb 4, 2025
Prelithiated hybridized energy storage device
TESLA INC0 citations62
DELPHI TECH INC
6 patentsUS6358064B2Mar 19, 2002
Z-axis electrical interconnect
DELPHI TECH INC44 citations91
US6547944B2Apr 15, 2003
Commercial plating of nanolaminates
DELPHI TECH INC49 citations90
US6614659B2Sep 2, 2003
De-mountable, solderless in-line lead module package with interface
DELPHI TECH INC41 citations89
US7504839B2Mar 17, 2009
Flexible circuit with micro-sized probe tips and a method of making the same
DELPHI TECH INC18 citations79
US6434817B1Aug 20, 2002
Method for joining an integrated circuit
DELPHI TECH INC15 citations78
US6109369AAug 29, 2000
Chip scale package
DELPHI TECH INC9 citations67