Inventor
CRUMLY WILLIAM R
US29 patents
⚠️ This page may combine multiple inventors who share the name “CRUMLY WILLIAM R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HUGHES AIRCRAFT CO
20 patentsUS5395253AMar 7, 1995
Membrane connector with stretch induced micro scrub
HUGHES AIRCRAFT CO163 citations99
US5354205AOct 11, 1994
Electrical connections with shaped contacts
HUGHES AIRCRAFT CO131 citations99
US5412866AMay 9, 1995
Method of making a cast elastomer/membrane test probe assembly
HUGHES AIRCRAFT CO144 citations98
US5600256AFeb 4, 1997
Cast elastomer/membrane test probe assembly
HUGHES AIRCRAFT CO116 citations97
US5563521AOct 8, 1996
Membrane connector with stretch induced micro scrub
HUGHES AIRCRAFT CO63 citations96
US5307561AMay 3, 1994
Method for making 3-D electrical circuitry
HUGHES AIRCRAFT CO61 citations96
US5264787ANov 23, 1993
Rigid-flex circuits with raised features as IC test probes
HUGHES AIRCRAFT CO93 citations96
US5180311AJan 19, 1993
Resilient interconnection bridge
HUGHES AIRCRAFT CO64 citations96
US5069628ADec 3, 1991
Flexible electrical cable connector with double sided dots
HUGHES AIRCRAFT CO83 citations96
US5412539AMay 2, 1995
Multichip module with a mandrel-produced interconnecting decal
HUGHES AIRCRAFT CO69 citations94
US5364277ANov 15, 1994
Three-dimensional electroformed circuitry
HUGHES AIRCRAFT CO28 citations92
US5339027AAug 16, 1994
Rigid-flex circuits with raised features as IC test probes
HUGHES AIRCRAFT CO36 citations92
US5261158ANov 16, 1993
Method of forming a resilient interconnection bridge
HUGHES AIRCRAFT CO25 citations92
US5245750ASep 21, 1993
Method of connecting a spaced ic chip to a conductor and the article thereby obtained
HUGHES AIRCRAFT CO36 citations92
US5245135ASep 14, 1993
Stackable high density interconnection mechanism (SHIM)
HUGHES AIRCRAFT CO54 citations92
US5233157AAug 3, 1993
Laser pattern ablation of fine line circuitry masters
HUGHES AIRCRAFT CO47 citations92
US5197184AMar 30, 1993
Method of forming three-dimensional circuitry
HUGHES AIRCRAFT CO38 citations92
US5207887AMay 4, 1993
Semi-additive circuitry with raised features using formed mandrels
HUGHES AIRCRAFT CO49 citations91
US5340296AAug 23, 1994
Resilient interconnection bridge
HUGHES AIRCRAFT CO8 citations74
US5009605AApr 23, 1991
Flat electrical connector assembly with precisely aligned soldering traces
HUGHES AIRCRAFT CO15 citations71
PACKARD HUGHES INTERCONNECT CO
7 patentsUS5946555AAug 31, 1999
Wafer level decal for minimal packaging of chips
PACKARD HUGHES INTERCONNECT CO57 citations96
US6166333ADec 26, 2000
Bumps with plural under-bump dielectric layers
PACKARD HUGHES INTERCONNECT CO47 citations92
US5896271AApr 20, 1999
Integrated circuit with a chip on dot and a heat sink
PACKARD HUGHES INTERCONNECT CO44 citations92
US5762845AJun 9, 1998
Method of making circuit with conductive and non-conductive raised features
PACKARD HUGHES INTERCONNECT CO35 citations92
US5924193AJul 20, 1999
Method of making mandrels and circuits therefrom
PACKARD HUGHES INTERCONNECT CO21 citations88
US6007669ADec 28, 1999
Layer to layer interconnect
PACKARD HUGHES INTERCONNECT CO19 citations79
US6303988B1Oct 16, 2001
Wafer scale burn-in socket
PACKARD HUGHES INTERCONNECT CO11 citations74