P

Inventor

KIM JAE K

KR41 patents
⚠️ This page may combine multiple inventors who share the name “KIM JAE K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HYUNDAI ELECTRONICS IND

34 patents
US5565372AOct 15, 1996

Method of manufacturing a self-aligned bit line contact to a semiconductor device

HYUNDAI ELECTRONICS IND58 citations96
US5413961AMay 9, 1995

Method for forming a contact of a semiconductor device

HYUNDAI ELECTRONICS IND58 citations96
US5149676ASep 22, 1992

Silicon layer having increased surface area and method for manufacturing

HYUNDAI ELECTRONICS IND49 citations95
US5580811ADec 3, 1996

Method for the fabrication of a semiconductor memory device having a capacitor

HYUNDAI ELECTRONICS IND29 citations92
US5573969ANov 12, 1996

Method for fabrication of CMOS devices having minimized drain contact area

HYUNDAI ELECTRONICS IND27 citations92
US5569948AOct 29, 1996

Semiconductor device having a contact plug and contact pad

HYUNDAI ELECTRONICS IND37 citations92
US5466637ANov 14, 1995

Method of making a self-aligned contact in semiconductor device

HYUNDAI ELECTRONICS IND56 citations92
US5427980AJun 27, 1995

Method of making a contact of a semiconductor memory device

HYUNDAI ELECTRONICS IND20 citations92
US5332693AJul 26, 1994

Method for manufacturing aluminum wired layer for interconnecting device to device in a semiconductor device

HYUNDAI ELECTRONICS IND27 citations92
US5318925AJun 7, 1994

Method of manufacturing a self-aligned interlayer contact in a semiconductor device

HYUNDAI ELECTRONICS IND26 citations92
US5315141AMay 24, 1994

Semiconductor memory device having a double-stacked capacitor structure

HYUNDAI ELECTRONICS IND28 citations92
US5081060AJan 14, 1992

Method for forming a connection device in a semiconductor device

HYUNDAI ELECTRONICS IND28 citations92
US5510286AApr 23, 1996

Method for forming narrow contact holes of a semiconductor device

HYUNDAI ELECTRONICS IND19 citations84
US5081066AJan 14, 1992

Method for forming a silicide film used in a semiconductor chip

HYUNDAI ELECTRONICS IND21 citations82
US5534450AJul 9, 1996

Method for fabrication a semiconductor device

HYUNDAI ELECTRONICS IND9 citations74
US5530294AJun 25, 1996

Semiconductor contact that partially overlaps a conductive line pattern and a method of manufacturing same

HYUNDAI ELECTRONICS IND7 citations74
US5525532AJun 11, 1996

Method for fabricating a semiconductor device

HYUNDAI ELECTRONICS IND10 citations74
US5474950ADec 12, 1995

Method for manufacturing a capacitor in a semiconductor device

HYUNDAI ELECTRONICS IND11 citations74
US5461004AOct 24, 1995

Method for fabricating connection device with reduced area of highly integrated semiconductor device

HYUNDAI ELECTRONICS IND19 citations74
US5441909AAug 15, 1995

Method for constructing charge storage electrode of semiconductor memory device

HYUNDAI ELECTRONICS IND8 citations74
US5358903AOct 25, 1994

Contact of a semiconductor device and its manufacturing process

HYUNDAI ELECTRONICS IND18 citations74
US5270238ADec 14, 1993

Method of making a semiconductor memory device having a double-stacked capacitor structure

HYUNDAI ELECTRONICS IND13 citations74
US5162249ANov 10, 1992

Method of making semiconductor memory device having a double stacked capacitor

HYUNDAI ELECTRONICS IND9 citations74
US5304828AApr 19, 1994

Silicon layer having increased surface area and method for manufacturing

HYUNDAI ELECTRONICS IND14 citations73
US5332696AJul 26, 1994

Method for manufacturing a silicon layer having increased surface area

HYUNDAI ELECTRONICS IND13 citations71
US5232876AAug 3, 1993

Method for manufacturing a silicon layer having increased surface area

HYUNDAI ELECTRONICS IND12 citations71
US5270239ADec 14, 1993

Method for manufacturing a dynamic random access memory cell

HYUNDAI ELECTRONICS IND16 citations67
US5474951ADec 12, 1995

Method for making a charge storage electrode for a semiconductor device

HYUNDAI ELECTRONICS IND11 citations64
US5624866AApr 29, 1997

Semiconductor device provided with trench element isolation film and method for fabricating the same

HYUNDAI ELECTRONICS IND5 citations63
US5514911AMay 7, 1996

Highly integrated semiconductor device contact structure

HYUNDAI ELECTRONICS IND4 citations63
US5491109AFeb 13, 1996

Method for the construction of highly integrated semiconductor connecting device

HYUNDAI ELECTRONICS IND2 citations63
US5366930ANov 22, 1994

Method for making highly integrated semiconductor connecting device using a conductive plug

HYUNDAI ELECTRONICS IND4 citations63
US5532515AJul 2, 1996

Semiconductor connecting device

HYUNDAI ELECTRONICS IND0 citations52
US5331733AJul 26, 1994

Method for manufacturing a connection device for a semiconductor device

HYUNDAI ELECTRONICS IND0 citations42

TONG YANG NYLON CO LTD

2 patents

GEN ELECTRIC

1 patent

HAJIAN ARSEN R

1 patent

SYNNYBROOK HEALTH SCIENCE CT

1 patent

KOREA ADVANCED INST SCI & TECH

1 patent

CENKO ANDREW T

1 patent