Inventor

HIRANO NAOHIKO

JP29 patents

⚠️ This page may combine multiple inventors who share the name “HIRANO NAOHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HIRANO NAOHIKO

DENSO CORP

Transfer-molded power device and method for manufacturing transfer-molded power device

Double-sided cooling type semiconductor module

Method for manufacturing semiconductor device having controlled surface roughness

Molded semiconductor power device having heat sinks exposed on one surface

Semiconductor device having a protective film

Insulated gate bipolar transistor

Silicon carbide semiconductor substrate and method for manufacturing same

Solder preform and electronic component

Switching circuit

Semiconductor device having heat radiation plate and bonding member

Semiconductor device having metallic plate with groove

Mold type semiconductor device

Method for manufacturing mold type semiconductor device

Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same

Semiconductor device

TOSHIBA KK

Multilayer wiring structure for attaining high-speed signal propagation

Flip-chip connection type semiconductor integrated circuit device

Flip-chip semiconductor devices having two encapsulants

Flip chip mounting type semiconductor device

Connecting electrode portion in semiconductor device

Multilayer package

Semiconductor device of multichip module-type

Flip-chip connecting type semiconductor device

Semiconductor device having temperature regulation means formed in circuit board

Semiconductor apparatus capable of cooling a semiconductor element with radiation efficiency

Semiconductor device and method of manufacturing the same

Semiconductor apparatus capable of cooling a semiconductor element with low radiation efficiency

SENJU METAL INDUSTRY CO

Solder preform and a process for its manufacture

HIRANO NAOHIKO

Solder preform and a process for its manufacture