Inventor

HIRUTA YOICHI

JP19 patents

⚠️ This page may combine multiple inventors who share the name “HIRUTA YOICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HIRUTA YOICHI

TOSHIBA KK

Flip-chip connection type semiconductor integrated circuit device

Flip-chip semiconductor devices having two encapsulants

Flip chip mounting type semiconductor device

Connecting electrode portion in semiconductor device

Semiconductor device having ball grid array

Electronic device having a chip with an external bump terminal equal or smaller than a via hole on a board

Semiconductor device of multichip module-type

Reel tape for provisionally supporting a bare chip

Board for evaluating the characteristics of a semiconductor chip and a method for mounting a semiconductor chip thereon

Method of manufacturing a semiconductor device

Multi-chip package type semiconductor device

Method of manufacturing MOS transistor by dual species implantation and rapid annealing

Manufacturing MOS semiconductor device with planarized conductive layer

Bare chip prober device

Power source noise suppressing type semiconductor device

Semiconductor integrated circuit device having sealing means

Semiconductor device and method for mounting semiconductor wafer

Semiconductor device and manufacturing method thereof

IMAIZUMI YUKARI

Semiconductor device