Inventor
HSIA SHAW-TZENG
TW11 patents
⚠️ This page may combine multiple inventors who share the name “HSIA SHAW-TZENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
6 patentsUS5393708AFeb 28, 1995
Inter-metal-dielectric planarization process
IND TECH RES INST97 citations96
US5356836AOct 18, 1994
Aluminum plug process
IND TECH RES INST70 citations96
US5286675AFeb 15, 1994
Blanket tungsten etchback process using disposable spin-on-glass
IND TECH RES INST80 citations96
US5250472AOct 5, 1993
Spin-on-glass integration planarization having siloxane partial etchback and silicate processes
IND TECH RES INST58 citations96
US5461010AOct 24, 1995
Two step etch back spin-on-glass process for semiconductor planarization
IND TECH RES INST34 citations92
US5366850ANov 22, 1994
Submicron planarization process with passivation on metal line
IND TECH RES INST21 citations92
VANGUARD INT SEMICONDUCT CORP
4 patentsUS5705442AJan 6, 1998
Optimized tungsten contact plug process via use of furnace annealed barrier layers
VANGUARD INT SEMICONDUCT CORP35 citations91
US5591672AJan 7, 1997
Annealing of titanium - titanium nitride in contact hole
VANGUARD INT SEMICONDUCT CORP38 citations91
US5552340ASep 3, 1996
Nitridation of titanium, for use with tungsten filled contact holes
VANGUARD INT SEMICONDUCT CORP33 citations91
US5849640ADec 15, 1998
In-situ SOG etchback and deposition for IMD process
VANGUARD INT SEMICONDUCT CORP38 citations88