Inventor
MCCORMACK MARK THOMAS
US24 patents
⚠️ This page may combine multiple inventors who share the name “MCCORMACK MARK THOMAS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
15 patentsUS6684007B2Jan 27, 2004
Optical coupling structures and the fabrication processes
FUJITSU LTD249 citations98
US6544430B2Apr 8, 2003
Methods for detaching a layer from a substrate
FUJITSU LTD118 citations98
US6326555B1Dec 4, 2001
Method and structure of z-connected laminated substrate for high density electronic packaging
FUJITSU LTD93 citations98
US6669801B2Dec 30, 2003
Device transfer method
FUJITSU LTD106 citations97
US6572780B2Jun 3, 2003
Methods for fabricating flexible circuit structures
FUJITSU LTD99 citations97
US6054761AApr 25, 2000
Multi-layer circuit substrates and electrical assemblies having conductive composition connectors
FUJITSU LTD103 citations97
US6521530B2Feb 18, 2003
Composite interposer and method for producing a composite interposer
FUJITSU LTD237 citations96
US6271107B1Aug 7, 2001
Semiconductor with polymeric layer
FUJITSU LTD95 citations96
US6163957ADec 26, 2000
Multilayer laminated substrates with high density interconnects and methods of making the same
FUJITSU LTD138 citations95
US6759257B2Jul 6, 2004
Structure and method for embedding capacitors in z-connected multi-chip modules
FUJITSU LTD27 citations92
US7513037B2Apr 7, 2009
Method of embedding components in multi-layer circuit boards
FUJITSU LTD9 citations84
US7199307B2Apr 3, 2007
Structure and method for embedding capacitors in z-connected multi-chip modules
FUJITSU LTD6 citations74
US6579474B2Jun 17, 2003
Conductive composition
FUJITSU LTD6 citations73
US6281040B1Aug 28, 2001
Methods for making circuit substrates and electrical assemblies
FUJITSU LTD6 citations73
US6866741B2Mar 15, 2005
Method for joining large substrates
FUJITSU LTD5 citations62
LUCENT TECHNOLOGIES INC
5 patentsUS5846366ADec 8, 1998
Method for interconnecting an electronic device using a transferable solder carrying medium
LUCENT TECHNOLOGIES INC46 citations93
US5762866AJun 9, 1998
Article comprising a Pb-free solder having improved mechanical properties
LUCENT TECHNOLOGIES INC21 citations93
US5834709ANov 10, 1998
Position sensing systems including magnetoresistive elements
LUCENT TECHNOLOGIES INC31 citations92
US5747918AMay 5, 1998
Display apparatus comprising diamond field emitters
LUCENT TECHNOLOGIES INC24 citations92
US5698160ADec 16, 1997
Lead-free alloys for use in solder bonding
LUCENT TECHNOLOGIES INC39 citations92
MICROSOFT TECHNOLOGY LICENSING LLC
3 patentsUS9661770B2May 23, 2017
Graphic formation via material ablation
MICROSOFT TECHNOLOGY LICENSING LLC3 citations72
US10910281B2Feb 2, 2021
Integrated circuit metallic ion diffusion defect validation
MICROSOFT TECHNOLOGY LICENSING LLC0 citations55
US9563233B2Feb 7, 2017
Electronic device with plated electrical contact
MICROSOFT TECHNOLOGY LICENSING LLC1 citations45