Inventor
PETERS MICHAEL G
US28 patents
⚠️ This page may combine multiple inventors who share the name “PETERS MICHAEL G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
24 patentsUS6039889AMar 21, 2000
Process flows for formation of fine structure layer pairs on flexible films
FUJITSU LTD156 citations99
US5454161AOct 3, 1995
Through hole interconnect substrate fabrication process
FUJITSU LTD256 citations99
US6239485B1May 29, 2001
Reduced cross-talk noise high density signal interposer with power and ground wrap
FUJITSU LTD194 citations98
US6187652B1Feb 13, 2001
Method of fabrication of multiple-layer high density substrate
FUJITSU LTD177 citations98
US5854534ADec 29, 1998
Controlled impedence interposer substrate
FUJITSU LTD238 citations98
US6168972B1Jan 2, 2001
Flip chip pre-assembly underfill process
FUJITSU LTD108 citations97
US6521530B2Feb 18, 2003
Composite interposer and method for producing a composite interposer
FUJITSU LTD237 citations96
US6102710AAug 15, 2000
Controlled impedance interposer substrate and method of making
FUJITSU LTD68 citations96
US6081026AJun 27, 2000
High density signal interposer with power and ground wrap
FUJITSU LTD61 citations96
US5872696AFeb 16, 1999
Sputtered and anodized capacitors capable of withstanding exposure to high temperatures
FUJITSU LTD69 citations96
US5544017AAug 6, 1996
Multichip module substrate
FUJITSU LTD91 citations96
US5455064AOct 3, 1995
Process for fabricating a substrate with thin film capacitor and insulating plug
FUJITSU LTD57 citations96
US5419038AMay 30, 1995
Method for fabricating thin-film interconnector
FUJITSU LTD96 citations96
US5891354AApr 6, 1999
Methods of etching through wafers and substrates with a composite etch stop layer
FUJITSU LTD50 citations93
US6662443B2Dec 16, 2003
Method of fabricating a substrate with a via connection
FUJITSU LTD47 citations92
US6226171B1May 1, 2001
Power conducting substrates with high-yield integrated substrate capacitor
FUJITSU LTD24 citations92
US6197664B1Mar 6, 2001
Method for electroplating vias or through holes in substrates having conductors on both sides
FUJITSU LTD35 citations92
US5817533AOct 6, 1998
High-yield methods of fabricating large substrate capacitors
FUJITSU LTD43 citations92
US5652693AJul 29, 1997
Substrate with thin film capacitor and insulating plug
FUJITSU LTD25 citations92
US5323520AJun 28, 1994
Process for fabricating a substrate with thin film capacitor
FUJITSU LTD35 citations92
US7513037B2Apr 7, 2009
Method of embedding components in multi-layer circuit boards
FUJITSU LTD9 citations84
US5406446AApr 11, 1995
Thin film capacitor
FUJITSU LTD17 citations82
US6106923AAug 22, 2000
Venting hole designs for multilayer conductor-dielectric structures
FUJITSU LTD14 citations74
US5778529AJul 14, 1998
Method of making a multichip module substrate
FUJITSU LTD10 citations73