P

Inventor

TAKAHASHI YASUHITO

JP44 patents
⚠️ This page may combine multiple inventors who share the name “TAKAHASHI YASUHITO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUJITSU LTD

19 patents
US7002080B2Feb 21, 2006

Multilayer wiring board

FUJITSU LTD69 citations98
US6684007B2Jan 27, 2004

Optical coupling structures and the fabrication processes

FUJITSU LTD249 citations98
US6239485B1May 29, 2001

Reduced cross-talk noise high density signal interposer with power and ground wrap

FUJITSU LTD194 citations98
US6785447B2Aug 31, 2004

Single and multilayer waveguides and fabrication process

FUJITSU LTD143 citations97
US6168972B1Jan 2, 2001

Flip chip pre-assembly underfill process

FUJITSU LTD108 citations97
US6054761AApr 25, 2000

Multi-layer circuit substrates and electrical assemblies having conductive composition connectors

FUJITSU LTD103 citations97
US6081026AJun 27, 2000

High density signal interposer with power and ground wrap

FUJITSU LTD61 citations96
US5872696AFeb 16, 1999

Sputtered and anodized capacitors capable of withstanding exposure to high temperatures

FUJITSU LTD69 citations96
US6869665B2Mar 22, 2005

Wiring board with core layer containing inorganic filler

FUJITSU LTD64 citations94
US6448106B1Sep 10, 2002

Modules with pins and methods for making modules with pins

FUJITSU LTD26 citations92
US6226171B1May 1, 2001

Power conducting substrates with high-yield integrated substrate capacitor

FUJITSU LTD24 citations92
US6428942B1Aug 6, 2002

Multilayer circuit structure build up method

FUJITSU LTD32 citations91
US7513037B2Apr 7, 2009

Method of embedding components in multi-layer circuit boards

FUJITSU LTD9 citations84
US6106923AAug 22, 2000

Venting hole designs for multilayer conductor-dielectric structures

FUJITSU LTD14 citations74
US6579474B2Jun 17, 2003

Conductive composition

FUJITSU LTD6 citations73
US6281040B1Aug 28, 2001

Methods for making circuit substrates and electrical assemblies

FUJITSU LTD6 citations73
US6184476B1Feb 6, 2001

Thin multi-layer circuit board having a remodeling pad layer and a metallic barrier layer with an exclusion zone

FUJITSU LTD10 citations72
US5679268AOct 21, 1997

Thin multi-layer circuit board and process for fabricating the same

FUJITSU LTD9 citations72
US6389686B2May 21, 2002

Process for fabricating a thin multi-layer circuit board

FUJITSU LTD4 citations61

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

8 patents

FUJI XEROX CO LTD

6 patents

PANASONIC CORP

4 patents

SUMITOMO METAL MINING CO

3 patents

TAKAHASHI YASUHITO

1 patent

NIPPON KETJEN CO LTD

1 patent

NANG HNIN NWAY SAN

1 patent

MINEMOTO HISASHI

1 patent