Inventor
LEE TAE KEUN
KR36 patents
⚠️ This page may combine multiple inventors who share the name “LEE TAE KEUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LG DISPLAY CO LTD
13 patentsUS10991302B1Apr 27, 2021
Gate driving circuit and display device using the same
LG DISPLAY CO LTD12 citations85
US9429785B2Aug 30, 2016
In-cell touch type liquid crystal display device
LG DISPLAY CO LTD7 citations84
US9329424B2May 3, 2016
In-cell touch type liquid crystal display device
LG DISPLAY CO LTD12 citations84
US11798482B2Oct 24, 2023
Gate driver and organic light emitting display device including the same
LG DISPLAY CO LTD3 citations72
US12567374B2Mar 3, 2026
Gate driver and organic light emitting display device including the same
LG DISPLAY CO LTD0 citations62
US12230213B2Feb 18, 2025
Gate driver and organic light emitting display device including the same
LG DISPLAY CO LTD0 citations62
US11462174B2Oct 4, 2022
Plurality of scan driver having shared scan lines and display apparatus including the same
LG DISPLAY CO LTD1 citations62
US11367397B2Jun 21, 2022
Gate driver and organic light emitting display device including the same
LG DISPLAY CO LTD0 citations62
US12069904B2Aug 20, 2024
Light emitting diode display apparatus
LG DISPLAY CO LTD0 citations55
US9165953B2Oct 20, 2015
Flat panel display device with oxide thin film transistors and method for fabricating the same
LG DISPLAY CO LTD0 citations52
US8866224B2Oct 21, 2014
Display device
LG DISPLAY CO LTD1 citations46
US10684711B2Jun 16, 2020
Subpixel structure of display device and touch screen-integrated display device having the same
LG DISPLAY CO LTD0 citations42
US9583511B2Feb 28, 2017
Array substrate having integrated gate driver and method of fabricating the same
LG DISPLAY CO LTD0 citations40
STATS CHIPPAC LTD
12 patentsUS8030755B2Oct 4, 2011
Integrated circuit package system with a heat sink
STATS CHIPPAC LTD7 citations82
US7517729B2Apr 14, 2009
Integrated circuit package system with heat slug
STATS CHIPPAC LTD5 citations74
US7714451B2May 11, 2010
Semiconductor package system with thermal die bonding
STATS CHIPPAC LTD6 citations72
US7309622B2Dec 18, 2007
Integrated circuit package system with heat sink
STATS CHIPPAC LTD2 citations63
US8729687B2May 20, 2014
Stackable integrated circuit package system
STATS CHIPPAC LTD2 citations62
US7759783B2Jul 20, 2010
Integrated circuit package system employing thin profile techniques
STATS CHIPPAC LTD4 citations62
US7705475B2Apr 27, 2010
Integrated circuit package system
STATS CHIPPAC LTD2 citations62
US7682872B2Mar 23, 2010
Integrated circuit package system with underfill
STATS CHIPPAC LTD4 citations60
US7851268B2Dec 14, 2010
Integrated circuit package system using heat slug
STATS CHIPPAC LTD3 citations57
US8035237B2Oct 11, 2011
Integrated circuit package system with heat slug
STATS CHIPPAC LTD0 citations52
US7521780B2Apr 21, 2009
Integrated circuit package system with heat dissipation enclosure
STATS CHIPPAC LTD0 citations52
US8022531B2Sep 20, 2011
Integrated circuit package system using heat slug
STATS CHIPPAC LTD0 citations47