Inventor

YONEZAWA TAKAHIRO

JP23 patents

⚠️ This page may combine multiple inventors who share the name “YONEZAWA TAKAHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YONEZAWA TAKAHIRO

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Semiconductor device and manufacturing method thereof

Method of forming a ball bond using a bonding capillary

Bump bonding method and bump bonding apparatus

Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor

Ultrasonic wire bonding apparatus and method

Apparatus for mounting electronic component on substrate

Mounting apparatus of electronic component

Bump bonding method apparatus

Bonding apparatus and bonding method

Working method for holding a work object by suction

Bump bonder with a discard bonding area

Semiconductor element having protruded bump electrodes

Semiconductor element having protruded bump electrodes

Film substrate treatment apparatus, film substrate treatment method, and film substrate transport method

Bump bonding device and bump bonding method

Electronic component mounting apparatus and electronic component mounting method

Bonding method and apparatus

Bare chip mounting method and bare chip mounting system

Bump levelling method and bump levelling apparatus

Bump bonding device and bump bonding method

TOKYO ELECTRON LTD

Plasma processing method, plasma processing apparatus, and plasma processing system

Plasma processing method and plasma processing apparatus

FUJITSU LTD

Delay measuring circuit and delay measuring method