Inventor
EGUCHI SHINZO
JP5 patents
Patents
5 patentsUS6439447B1Aug 27, 2002
Bump joining judging device and method, and semiconductor component production device and method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD23 citations91
US5854745ADec 29, 1998
Method and apparatus for mounting electronic component
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD42 citations91
US6328196B1Dec 11, 2001
Bump bonding device and bump bonding method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD8 citations72
US5899140AMay 4, 1999
Bump levelling method and bump levelling apparatus
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD5 citations62
US6481616B2Nov 19, 2002
Bump bonding device and bump bonding method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD0 citations50