Inventor
LIEHR MICHAEL
DE19 patents
⚠️ This page may combine multiple inventors who share the name “LIEHR MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LEYBOLD SYSTEMS GMBH
9 patentsUS6194835B1Feb 27, 2001
Device for producing plasma
LEYBOLD SYSTEMS GMBH24 citations92
US6242053B1Jun 5, 2001
Process for coating plastic containers or glass containers by means of a PCVD coating process
LEYBOLD SYSTEMS GMBH16 citations82
US6416292B1Jul 9, 2002
Method for transporting at least one vaporous substance through the wall of a vacuum chamber and into the vacuum chamber and a device for executing and utilizing the method
LEYBOLD SYSTEMS GMBH9 citations73
US6191532B1Feb 20, 2001
Arrangement for producing plasma
LEYBOLD SYSTEMS GMBH11 citations73
US6175183B1Jan 16, 2001
Device for producing plasma
LEYBOLD SYSTEMS GMBH8 citations73
US6161501ADec 19, 2000
Device for plasma generation
LEYBOLD SYSTEMS GMBH7 citations73
US6126792AOct 3, 2000
Method for the application of a scratch protection layer and an antireflection coating system and apparatus for its execution
LEYBOLD SYSTEMS GMBH10 citations73
US5900065AMay 4, 1999
Apparatus for the plasma-chemical deposition of polycrystalline diamond
LEYBOLD SYSTEMS GMBH11 citations73
US6077407AJun 20, 2000
Sputtering cathode based on the magnetron principle
LEYBOLD SYSTEMS GMBH11 citations71
IBM
6 patentsUS5897336AApr 27, 1999
Direct chip attach for low alpha emission interconnect system
IBM42 citations92
US6566612B2May 20, 2003
Method for direct chip attach by solder bumps and an underfill layer
IBM20 citations91
US6341418B1Jan 29, 2002
Method for direct chip attach by solder bumps and an underfill layer
IBM21 citations91
US6340630B1Jan 22, 2002
Method for making interconnect for low temperature chip attachment
IBM28 citations91
US6127735AOct 3, 2000
Interconnect for low temperature chip attachment
IBM41 citations91
US4794863AJan 3, 1989
Motive structure for transporting workpieces
IBM19 citations70