Inventor

SANE SANDEEP B

US24 patents

⚠️ This page may combine multiple inventors who share the name “SANE SANDEEP B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SANE SANDEEP B

INTEL CORP

Low temperature phase change thermal interface material dam

Modified chip attach process and apparatus

Interconnect architecture with silicon interposer and EMIB

Microelectronic bond pads having integrated spring structures

Modified chip attach process

Modified chip attach process

Modified chip attach process and apparatus

Contact pads for integrated circuit packages

Die warpage control for thin die assembly

Warpage controlled package and method for same

Systems and methods for package on package through mold interconnects

Interconnect architecture with silicon interposer and EMIB

Interconnect architecture with silicon interposer and EMIB

Methods of utilizing low temperature solder assisted mounting techniques for package structures

Method for reducing assembly-induced stress in a semiconductor die

Package substrate with reduced interconnect stress

Methods of forming flexure based cooling solutions for package structures

Microelectronic bond pads having integrated spring structures

Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby

Electrical and optical interfaces at different heights along an edge of a package to increase bandwidth along the edge

IBM

Laminate substrate containing fiber optic cables

CHANDRAN BIJU

Modified chip attach process

LIMAYE AMEYA

Using collapse limiter structures between elements to reduce solder bump bridging

SANE SANDEEP B

Die warpage control for thin die assembly