Inventor

CHANDRAN BIJU

US20 patents

⚠️ This page may combine multiple inventors who share the name “CHANDRAN BIJU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANDRAN BIJU

INTEL CORP

Microelectronic device interconnects

Heat sink system

Method of interconnecting die and substrate

Modified chip attach process and apparatus

Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices

Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices

Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices

Integrated circuit cartridge and method of fabricating the same

Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby

Package retention module coupled directly to a socket

Package retention module coupled directly to a socket

Modified chip attach process

Modified chip attach process

Modified chip attach process and apparatus

Contact array for semiconductor package

Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices

Microelectronic device interconnects

Compliant integrated circuit package substrate

Compliant integrated circuit package substrate

CHANDRAN BIJU

Modified chip attach process