Inventor

OGINO MASAHIKO

JP72 patents

⚠️ This page may combine multiple inventors who share the name “OGINO MASAHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OGINO MASAHIKO

HITACHI LTD

Semiconductor module and method of mounting

Semiconductor device having a stress relieving mechanism

Laminate and multilayer printed circuit board

Semiconductor apparatus having stress cushioning layer

Laminate and multilayer printed circuit board

Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same

Semiconductor module and mounting method for same

Nanoprint equipment and method of making fine structure

Semiconductor connection substrate

Semiconductor device with elastic structure and wiring

Semiconductor device having a porous buffer layer for semiconductor device

Method of making a semiconductor device having a stress relieving mechanism

Semiconductor device and method for manufacturing the same technical field

Semiconductor apparatus and a manufacturing method thereof

Semiconductor device with chip size package

Stamper and transfer apparatus

Pattern forming method and pattern forming system

Belt-shaped mold and nanoimprint system using the belt-shaped mold

Electronic circuit component

Thin film capacitor and electronic circuit component

Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same

Semiconductor device and its manufacturing method

Cell culture vessel and cultured cell

RENESAS TECH CORP

Semiconductor module and mounting method for same

Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device

Semiconductor device comprising stress relaxation layers and method for manufacturing the same

Semiconductor device and manufacturing method thereof

Circuit tape having adhesive film semiconductor device and a method for manufacturing the same

Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device

Wiring tape for semiconductor device including a buffer layer having interconnected foams

OGINO MASAHIKO

Fine pattern mold

Photocurable resin composition and a method for forming a pattern

Mold structures, and method of transfer of fine structures

Pattern forming method and its mold

Imprint apparatus and method for fine structure lithography

Fine pattern mold

WASHIYA RYUTA

Method and apparatus for imprinting microstructure and stamper therefor

Device and method for transferring micro structure

Micropattern transfer device

ANDO TAKASHI

Imprint device and microstructure transfer method

Pattern transfer method and imprint device

Pattern transfer method and imprint device

ISHII SATOSHI

Stamper for transferring fine pattern and method for manufacturing thereof

Micropattern transfer method and micropattern transfer device

YOSHIDA HIROSHI

Fine metal structure, process for producing the same, fine metal mold and device

HITACHI CHEMICAL CO LTD

Photo-curable resin composition and a method for forming a pattern using the same

MIYAUCHI AKIHIRO

Electrolyte membrane for fuel cells, its production and fuel cell using the same

OHASHI KENYA

Mold for fine pattern transfer and method for forming resin pattern using same

DOWA METALS & MINING CO LTD

Method and apparatus for recovering platinum group elements

HITACHI IND CO LTD

Nanoprint equipment and method of making fine structure