Inventor
MOTOWAKI SHIGEHISA
JP18 patents
⚠️ This page may combine multiple inventors who share the name “MOTOWAKI SHIGEHISA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
9 patentsUS7520742B2Apr 21, 2009
Nanoprint equipment and method of making fine structure
HITACHI LTD30 citations92
US7586755B2Sep 8, 2009
Electronic circuit component
HITACHI LTD11 citations84
US7047052B2May 16, 2006
Cellular phone terminal
HITACHI LTD14 citations83
US6840833B1Jan 11, 2005
Gas discharge type display panel and production method therefor
HITACHI LTD18 citations82
US5764129AJun 9, 1998
Ceramic resistor, production method thereof, neutral grounding resistor and circuit breaker
HITACHI LTD12 citations71
US5614138AMar 25, 1997
Method of fabricating non-linear resistor
HITACHI LTD11 citations71
US5610570AMar 11, 1997
Voltage non-linear resistor and fabricating method thereof
HITACHI LTD11 citations70
US7964975B2Jun 21, 2011
Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them
HITACHI LTD1 citations51
US9136244B2Sep 15, 2015
Semiconductor package having a metal member and a resin mold, which are bonded to a silane coupling agent and an intermediate layer of an oxide film
HITACHI LTD0 citations41
KAJIWARA RYOICHI
4 patentsUS8314484B2Nov 20, 2012
Semiconductor device and method of manufacturing the same
KAJIWARA RYOICHI9 citations82
US8303854B2Nov 6, 2012
Sintering silver paste material and method for bonding semiconductor chip
KAJIWARA RYOICHI4 citations59
US8313983B2Nov 20, 2012
Fabrication method for resin-encapsulated semiconductor device
KAJIWARA RYOICHI0 citations51
US9209044B2Dec 8, 2015
Metal-resin composite, method for producing the same, busbar, module case, and resinous connector part
KAJIWARA RYOICHI1 citations48
RENESAS TECH CORP
2 patentsUS7183650B2Feb 27, 2007
Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate
RENESAS TECH CORP30 citations92
US7535106B2May 19, 2009
Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate
RENESAS TECH CORP1 citations51