Inventor
VENKATRAMAN RAMNATH
US34 patents
⚠️ This page may combine multiple inventors who share the name “VENKATRAMAN RAMNATH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LSI LOGIC CORP
13 patentsUS8044437B1Oct 25, 2011
Integrated circuit cell architecture configurable for memory or logic elements
LSI LOGIC CORP115 citations98
US6980462B1Dec 27, 2005
Memory cell architecture for reduced routing congestion
LSI LOGIC CORP58 citations96
US7006370B1Feb 28, 2006
Memory cell architecture
LSI LOGIC CORP50 citations92
US6566171B1May 20, 2003
Fuse construction for integrated circuit structure having low dielectric constant dielectric material
LSI LOGIC CORP30 citations92
US7082067B2Jul 25, 2006
Circuit for verifying the write speed of SRAM cells
LSI LOGIC CORP17 citations84
US6806551B2Oct 19, 2004
Fuse construction for integrated circuit structure having low dielectric constant dielectric material
LSI LOGIC CORP15 citations84
US6664141B1Dec 16, 2003
Method of forming metal fuses in CMOS processes with copper interconnect
LSI LOGIC CORP14 citations82
US6442061B1Aug 27, 2002
Single channel four transistor SRAM
LSI LOGIC CORP15 citations81
US7042747B1May 9, 2006
Ternary CAM bitcells
LSI LOGIC CORP13 citations79
US6828653B1Dec 7, 2004
Method of forming metal fuses in CMOS processes with copper interconnect
LSI LOGIC CORP12 citations71
US7006369B2Feb 28, 2006
Design and use of a spacer cell to support reconfigurable memories
LSI LOGIC CORP7 citations68
US6934174B2Aug 23, 2005
Reconfigurable memory arrays
LSI LOGIC CORP5 citations63
US7069535B2Jun 27, 2006
Optical proximity correction method using weighted priorities
LSI LOGIC CORP4 citations57
MOTOROLA INC
8 patentsUS6174810B1Jan 16, 2001
Copper interconnect structure and method of formation
MOTOROLA INC235 citations98
US6218302B1Apr 17, 2001
Method for forming a semiconductor device
MOTOROLA INC222 citations96
US5814557ASep 29, 1998
Method of forming an interconnect structure
MOTOROLA INC124 citations96
US5677244AOct 14, 1997
Method of alloying an interconnect structure with copper
MOTOROLA INC62 citations96
US6713381B2Mar 30, 2004
Method of forming semiconductor device including interconnect barrier layers
MOTOROLA INC135 citations95
US6093966AJul 25, 2000
Semiconductor device with a copper barrier layer and formation thereof
MOTOROLA INC116 citations94
US6077768AJun 20, 2000
Process for fabricating a multilevel interconnect
MOTOROLA INC24 citations91
US5783485AJul 21, 1998
Process for fabricating a metallized interconnect
MOTOROLA INC27 citations91
LSI CORP
5 patentsUS7404154B1Jul 22, 2008
Basic cell architecture for structured application-specific integrated circuits
LSI CORP130 citations97
US7440356B2Oct 21, 2008
Modular design of multiport memory bitcells
LSI CORP13 citations84
US7304874B2Dec 4, 2007
Compact ternary and binary CAM bitcell architecture with no enclosed diffusion areas
LSI CORP18 citations81
US9158319B2Oct 13, 2015
Closed-loop adaptive voltage scaling for integrated circuits
LSI CORP4 citations68
US7869251B2Jan 11, 2011
SRAM based one-time-programmable memory
LSI CORP4 citations63
VENKATRAMAN RAMNATH
5 patentsUS8178909B2May 15, 2012
Integrated circuit cell architecture configurable for memory or logic elements
VENKATRAMAN RAMNATH115 citations96
US8429586B2Apr 23, 2013
Basic cell architecture for structured ASICs
VENKATRAMAN RAMNATH5 citations80
US8738940B2May 27, 2014
Power controller for SoC power gating applications
VENKATRAMAN RAMNATH5 citations67
US8411399B2Apr 2, 2013
Defectivity-immune technique of implementing MIM-based decoupling capacitors
VENKATRAMAN RAMNATH4 citations62
US8166440B1Apr 24, 2012
Basic cell architecture for structured application-specific integrated circuits
VENKATRAMAN RAMNATH0 citations50