Inventor
JAECK EDWARD W
US4 patents
Patents
4 patentsUS6841855B2Jan 11, 2005
Electronic package having a flexible substrate with ends connected to one another
INTEL CORP78 citations96
US7563645B2Jul 21, 2009
Electronic package having a folded package substrate
INTEL CORP65 citations94
US6992376B2Jan 31, 2006
Electronic package having a folded package substrate
INTEL CORP58 citations93
US7057116B2Jun 6, 2006
Selective reference plane bridge(s) on folded package
INTEL CORP8 citations68