Inventor · disambiguated record
Hajime Hasebe
Also filed as: HASEBE HAJIME
20 granted patents·2 pending applications·354 citations·filing 1990–2018
95Inventor score
Top patents by PatentIndex Score
22 records- 0198US6713849B2Semiconductor utilizing grooves in lead and tab portions of lead frame to prevent peel off between the lead frame and the resinHITACHI LTD·Filed 2001·Granted Mar 30, 2004·168 cites·26 claims
- 0291US7911054B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Mar 22, 2011·12 cites·25 claims
- 0388US8581396B2Semiconductor deviceHASEBE HAJIME·Filed 2011·Granted Nov 12, 2013·7 cites·12 claims
- 0484US8044509B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Oct 25, 2011·4 cites·15 claims
- 0584US7518156B2Semiconductor deviceRENESAS TECH CORP·Filed 2003·Granted Apr 14, 2009·22 cites·13 claims
- 0683US10115658B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Oct 30, 2018·2 cites·22 claims
- 0779US7410834B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Aug 12, 2008·34 cites·23 claims
- 0878US9496204B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Nov 15, 2016·2 cites·34 claims
- 0977US7429500B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Sep 30, 2008·6 cites·10 claims
- 1075US7514293B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2008·Granted Apr 7, 2009·5 cites·5 claims
- 1169US5032895ASemiconductor device and method of producing the sameHITACHI LTD·Filed 1990·Granted Jul 16, 1991·37 cites·13 claims
- 1267US7348659B2Semiconductor device and method of manufacturing thereofRENESAS TECH CORP·Filed 2004·Granted Mar 25, 2008·13 cites·2 claims
- 1366US6924548B2Semiconductor device and its manufacturing method with leads that have an inverted trapezoid-like sectionRENESAS NTHN JP SEMICONDUCTOR·Filed 2001·Granted Aug 2, 2005·20 cites·87 claims
- 1465US10490486B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Nov 26, 2019·0 cites·9 claims
- 1565US8558362B2Semiconductor device and manufacturing method of the sameAMANO KENJI·Filed 2008·Granted Oct 15, 2013·3 cites·3 claims
- 1654US8618642B2Semiconductor deviceHASEBE HAJIME·Filed 2011·Granted Dec 31, 2013·0 cites·10 claims
- 1754US7948068B2Semiconductor device having a chip mounting portion and a plurality of suspending leads supporting the chip mounting portion and each suspension lead having a bent portionRENESAS ELECTRONICS CORP·Filed 2009·Granted May 24, 2011·0 cites·4 claims
- 1852US5304844ASemiconductor device and method of producing the sameHITACHI LTD·Filed 1992·Granted Apr 19, 1994·19 cites·11 claims
- 1950US7579674B2Semiconductor package configuration with improved lead portion arrangementRENESAS TECH CORP·Filed 2008·Granted Aug 25, 2009·0 cites·7 claims
- 2047US8102035B2Method of manufacturing a semiconductor deviceAMANO KENJI·Filed 2011·Granted Jan 24, 2012·0 cites·4 claims
- 2145US2008268576A1Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2008·Application pending·0 cites
- 2244US2008067643A1Semiconductor device and method of manufacturing the sameTANAKA SHIGEKI·Filed 2007·Application pending·0 cites
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