Inventor

MOLLA JAYNAL A

US46 patents

⚠️ This page may combine multiple inventors who share the name “MOLLA JAYNAL A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MOLLA JAYNAL A

NXP USA INC

Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof

Molded air cavity packages and methods for the production thereof

Molded air cavity packages and methods for the production thereof

Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof

Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof

Power amplifier packages containing peripherally-encapsulated dies and methods for the fabrication thereof

Semiconductor devices with protruding conductive vias and methods of making such devices

Die-substrate assemblies having sinter-bonded backside via structures and associated fabrication methods

Molded air cavity packages and methods for the production thereof

Molded air cavity packages and methods for the production thereof

Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods

Microelectronic components having integrated heat dissipation posts and systems including the same

Method of wafer dicing for wafers with backside metallization and packaged dies

Thick-silver layer interface

Semiconductor device package and methods of manufacture thereof

Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof

Packaged dies with metal outer layers extending from die back sides toward die front sides

Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods

Thick-silver layer interface

Low-stress thermal interface

FREESCALE SEMICONDUCTOR INC

Magnetic shielding for electronic circuits which include magnetic materials

Cladded conductor for use in a magnetoelectronics device and method for fabricating the same

Methods and apparatus for a dual-metal magnetic shield structure

Method for fabricating a flux concentrating system for use in a magnetoelectronics device

Method of applying cladding material on conductive lines of MRAM devices

Air cavity packages and methods for the production thereof

Semiconductor device package and methods of manufacture thereof

Cladded conductor for use in a magnetoelectronics device and method for fabricating the same

Semiconductor device with mechanical lock features between a semiconductor die and a substrate

Electronic devices with semiconductor die attached with sintered metallic layers, and methods of formation of such devices

Method of applying cladding material on conductive lines of MRAM devices

Method for fabricating a flux concentrating system for use in a magnetoelectronics device

IBM

Method of fabricating nendritic materials

Interconnection method and structure for organic circuit boards

Separable electrical connection technology

Process for fabrication of a selectively filled flexible adhesive device for solderless connection of electronic modules to a substrate

Interconnection method and structure for organic circuit boards

Method of forming a conductive end portion on a flexible circuit member

Selectively filled adhesives for compliant, reworkable, and solder-free flip chip interconnection and encapsulation

Method of solder bonding processor package

VISWANATHAN LAKSHMINARAYAN

Packaged semiconductor devices and methods of their fabrication

Electronic devices with semiconductor die coupled to a thermally conductive substrate

Solder wettable flanges and devices and systems incorporating solder wettable flanges

Thick-silver layer interface for a semiconductor die and corresponding thermal layer

EVERSPIN TECHNOLOGIES INC

Magnetoresistive device and method of packaging same

MOTOROLA INC

Field emission device having a vacuum bridge focusing structure and method