Inventor
LIN BURN-JENG
TW128 patents
⚠️ This page may combine multiple inventors who share the name “LIN BURN-JENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
28 patentsUS7252909B2Aug 7, 2007
Method to reduce CD non-uniformity in IC manufacturing
TAIWAN SEMICONDUCTOR MFG199 citations99
US6788477B2Sep 7, 2004
Apparatus for method for immersion lithography
TAIWAN SEMICONDUCTOR MFG517 citations99
US7224427B2May 29, 2007
Megasonic immersion lithography exposure apparatus and method
TAIWAN SEMICONDUCTOR MFG95 citations98
US7091502B2Aug 15, 2006
Apparatus and method for immersion lithography
TAIWAN SEMICONDUCTOR MFG72 citations98
US8822106B2Sep 2, 2014
Grid refinement method
TAIWAN SEMICONDUCTOR MFG31 citations96
US7266803B2Sep 4, 2007
Layout generation and optimization to improve photolithographic performance
TAIWAN SEMICONDUCTOR MFG82 citations96
US6492073B1Dec 10, 2002
Removal of line end shortening in microlithography and mask set for removal
TAIWAN SEMICONDUCTOR MFG59 citations96
US8846278B2Sep 30, 2014
Electron beam lithography system and method for improving throughput
TAIWAN SEMICONDUCTOR MFG26 citations93
US8828632B2Sep 9, 2014
Multiple-grid exposure method
TAIWAN SEMICONDUCTOR MFG26 citations93
US7234128B2Jun 19, 2007
Method for improving the critical dimension uniformity of patterned features on wafers
TAIWAN SEMICONDUCTOR MFG21 citations92
US6664011B2Dec 16, 2003
Hole printing by packing and unpacking using alternating phase-shifting masks
TAIWAN SEMICONDUCTOR MFG55 citations92
US6929887B1Aug 16, 2005
Printable assist lines and the removal of such
TAIWAN SEMICONDUCTOR MFG28 citations88
US8972908B2Mar 3, 2015
Method for electron beam proximity correction with improved critical dimension accuracy
TAIWAN SEMICONDUCTOR MFG10 citations84
US8822107B2Sep 2, 2014
Grid refinement method
TAIWAN SEMICONDUCTOR MFG5 citations84
US8381139B2Feb 19, 2013
Method for metal correlated via split for double patterning
TAIWAN SEMICONDUCTOR MFG12 citations84
US7986395B2Jul 26, 2011
Immersion lithography apparatus and methods
TAIWAN SEMICONDUCTOR MFG15 citations84
US7851774B2Dec 14, 2010
System and method for direct writing to a wafer
TAIWAN SEMICONDUCTOR MFG9 citations84
US7482280B2Jan 27, 2009
Method for forming a lithography pattern
TAIWAN SEMICONDUCTOR MFG13 citations84
US7180572B2Feb 20, 2007
Immersion optical projection system
TAIWAN SEMICONDUCTOR MFG11 citations84
US7934177B2Apr 26, 2011
Method and system for a pattern layout split
TAIWAN SEMICONDUCTOR MFG19 citations83
US7399709B1Jul 15, 2008
Complementary replacement of material
TAIWAN SEMICONDUCTOR MFG17 citations83
US7829248B2Nov 9, 2010
Pellicle stress relief
TAIWAN SEMICONDUCTOR MFG17 citations82
US6973636B2Dec 6, 2005
Method of defining forbidden pitches for a lithography exposure tool
TAIWAN SEMICONDUCTOR MFG12 citations82
US7501226B2Mar 10, 2009
Immersion lithography system with wafer sealing mechanisms
TAIWAN SEMICONDUCTOR MFG11 citations80
US7700267B2Apr 20, 2010
Immersion fluid for immersion lithography, and method of performing immersion lithography
TAIWAN SEMICONDUCTOR MFG7 citations74
US7659964B2Feb 9, 2010
Level adjustment systems and adjustable pin chuck thereof
TAIWAN SEMICONDUCTOR MFG7 citations74
US7307001B2Dec 11, 2007
Wafer repair method using direct-writing
TAIWAN SEMICONDUCTOR MFG5 citations74
US6492077B1Dec 10, 2002
Multiple-reticle mask holder and aligner
TAIWAN SEMICONDUCTOR MFG8 citations74
IBM
4 patentsUS5795685AAug 18, 1998
Simple repair method for phase shifting masks
IBM102 citations98
US5715064AFeb 3, 1998
Step and repeat apparatus having enhanced accuracy and increased throughput
IBM97 citations98
US4054383AOct 18, 1977
Jig and process for contact printing
IBM42 citations86
US3965299AJun 22, 1976
Dynamic magnetic bubble display system
IBM10 citations74
TAIWAN SEMICONDUCTOR MFG CO LTD
4 patentsUS9594862B2Mar 14, 2017
Method of fabricating an integrated circuit with non-printable dummy features
TAIWAN SEMICONDUCTOR MFG CO LTD19 citations92
US9810994B2Nov 7, 2017
Systems and methods for high-throughput and small-footprint scanning exposure for lithography
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US9436788B2Sep 6, 2016
Method of fabricating an integrated circuit with block dummy for optimized pattern density uniformity
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US9436787B2Sep 6, 2016
Method of fabricating an integrated circuit with optimized pattern density uniformity
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
LIN BURN JENG
3 patentsUS9046789B2Jun 2, 2015
Immersion lithography system using a sealed wafer bath
LIN BURN JENG12 citations92
US8767178B2Jul 1, 2014
Immersion lithography system using direction-controlling fluid inlets
LIN BURN JENG21 citations92
US8208116B2Jun 26, 2012
Immersion lithography system using a sealed wafer bath
LIN BURN JENG17 citations92
WANG CHIEN-WEI
2 patentsSHIN JAW-JUNG
2 patentsLiu pei-yi
2 patentsYU CHEN-HUA
1 patentCHANG CHING-YU
1 patentWANG WEN CHUAN
1 patentWANG HSIEN-CHENG
1 patentCHEN CHENG-HUNG
1 patentShowing the top 50 of 128 patents by PatentIndex Score.