Inventor
KAWATE KOHICHIRO
JP15 patents
⚠️ This page may combine multiple inventors who share the name “KAWATE KOHICHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
3M INNOVATIVE PROPERTIES CO
12 patentsUS6753379B1Jun 22, 2004
Heat activated adhesive
3M INNOVATIVE PROPERTIES CO61 citations91
US6590070B1Jul 8, 2003
Thermosetting adhesive composition and adhered structure
3M INNOVATIVE PROPERTIES CO20 citations91
US6265460B1Jul 24, 2001
Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition
3M INNOVATIVE PROPERTIES CO45 citations91
US6228500B1May 8, 2001
Adhesive composition and precursor thereof
3M INNOVATIVE PROPERTIES CO24 citations91
US6051652AApr 18, 2000
Reactive hot melt composition, composition for preparation of reactive hot melt composition, and film-form hot melt adhesive
3M INNOVATIVE PROPERTIES CO23 citations91
US6908318B2Jun 21, 2005
Batch electrically connecting sheet
3M INNOVATIVE PROPERTIES CO11 citations73
US11124646B2Sep 21, 2021
Heat-dissipating resin composition, cured product thereof, and method of using same
3M INNOVATIVE PROPERTIES CO0 citations62
US7358289B2Apr 15, 2008
Heat-curable adhesive composition
3M INNOVATIVE PROPERTIES CO4 citations61
US7888604B2Feb 15, 2011
Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method
3M INNOVATIVE PROPERTIES CO6 citations60
US7779538B2Aug 24, 2010
Method for mutually connecting circuit boards
3M INNOVATIVE PROPERTIES CO1 citations52
US9281255B2Mar 8, 2016
Underfill composition and semiconductor device and manufacturing method thereof
3M INNOVATIVE PROPERTIES CO1 citations51
US9773714B2Sep 26, 2017
Semiconductor package resin composition and usage method thereof
3M INNOVATIVE PROPERTIES CO0 citations49