Inventor

IIO MASASHI

JP30 patents

⚠️ This page may combine multiple inventors who share the name “IIO MASASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IIO MASASHI

SHINETSU CHEMICAL CO

Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film

Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film

Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, patterning process, and method for forming cured film

Silicone structure-bearing polymer, negative resist composition, photo-curable dry film, patterning process, and electric/electronic part-protecting film

Positive resist composition and patterning process

Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component

Tetracarboxylic dianhydride, polyimide resin and method for producing the same, photosensitive resin compositions, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts

Negative photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component

Positive photosensitive resin composition, positive photosensitive dry film, method for producing positive photosensitive dry film, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component

Positive photosensitive resin composition, positive photosensitive dry film, method for producing positive photosensitive dry film, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component

Photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic component

Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts

Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film

Polymer compound, chemically amplified negative resist composition, photo-curable dry film and production method thereof, layered product, patterning process, and substrate

Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts

Silicone skeleton-containing polymer compound and method for producing same, chemically amplified negative resist composition, photo-curable dry film and method for producing same, patterning process, layered product, and substrate

Chemically amplified positive resist composition and pattern forming process

Methods for manufacturing resin structure and micro-structure

Methods for manufacturing resin structure and micro-structure

Pattern forming process and resist-modifying composition

Positive photosensitive resin composition, photo-curable dry film and method for producing the same, patterning process, and laminate

Silicone skeleton-containing polymer compound, chemically amplified negative resist composition, photo-curable dry film and method for producing same, patterning process, layered product, substrate, and semiconductor apparatus

Positive photosensitive resin composition, photo-curable dry film and method for producing same, layered product, patterning process, and substrate

Negative resist composition and patterning process using same

WATANABE TAKERU

Resist-modifying composition and pattern forming process

Pattern forming process, chemically amplified positive resist composition, and resist-modifying composition

Resist-modifying composition and pattern forming process

IBM

Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component

Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component

HATAKEYAMA JUN

Patterning process