Inventor

KUO HSI-SHAN

TW6 patents

⚠️ This page may combine multiple inventors who share the name “KUO HSI-SHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MEGICA CORP

2 patents

US7208834B2Apr 24, 2007

Bonding structure with pillar and cap

MEGICA CORP59 citations97

US7960270B2Jun 14, 2011

Method for fabricating circuit component

MEGICA CORP14 citations92

LEE JIN-YUAN

2 patents

US8461679B2Jun 11, 2013

Method for fabricating circuit component

LEE JIN-YUAN9 citations83

US8890336B2Nov 18, 2014

Cylindrical bonding structure and method of manufacture

LEE JIN-YUAN2 citations62

MEGIC CORP

1 patent

US6784087B2Aug 31, 2004

Method of fabricating cylindrical bonding structure

MEGIC CORP60 citations95

TAIWAN SEMICONDUCTOR MFG

1 patent

US6032704AMar 7, 2000

Method and apparatus for storing wafers without moisture absorption

TAIWAN SEMICONDUCTOR MFG8 citations72