Inventor

LIN HUNG HUA

TW46 patents

⚠️ This page may combine multiple inventors who share the name “LIN HUNG HUA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN HUNG HUA

TAIWAN SEMICONDUCTOR MFG CO LTD

Integrate rinse module in hybrid bonding platform

Integrate rinse module in hybrid bonding platform

MEMS device having a metallization structure embedded in a dielectric structure with laterally offset sidewalls of a first portion and a second portion

Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer

Semiconductor arrangement and formation thereof

Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer

Semiconductor structure and manufacturing method thereof

Methods of forming micro-electro-mechanical devices including a conductive feature extending through an escort ring

Semiconductor arrangement and formation thereof

Pizoelectric MEMS device with electrodes having low surface roughness

Pizoelectric MEMS device with electrodes having low surface roughness

Method to protect electrodes from oxidation in a MEMS device

Integrate rinse module in hybrid bonding platform

Integrate rinse module in hybrid bonding platform

MEMs using outgassing material to adjust the pressure level in a cavity

Integrate rinse module in hybrid bonding platform

Debonding schemes

Conductive bond structure to increase membrane sensitivity in MEMS device

Undercut-free patterned aluminum nitride structure and methods for forming the same

Undercut-free patterned aluminum nitride structure and methods for forming the same

Conductive bond structure to increase membrane sensitivity in MEMS device

MEMS devices with an element having varying widths

Semiconductor arrangement and formation thereof

Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same

Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same

Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same

Method of manufacturing semiconductor structure

Biological sensing structures

Debonding schemes

Self-removal anti-stiction coating for bonding process

Method of improving getter efficiency by increasing superficial area

Method of improving getter efficiency by increasing superficial area

Method of selectively removing an anti-stiction layer on a eutectic bonding area

Method for controlling surface roughness in MEMS structure

TAIWAN SEMICONDUCTOR MFG

Methods for hybrid wafer bonding

MEMS devices and methods of forming the same

Biological sensing structures

Wafer level packaging bond

TSAI SHANG-YING

MEMS devices and methods of forming the same

Method to prevent metal pad damage in wafer level package

LIU PING-YIN

Self-removal anti-stiction coating for bonding process

LIU MARTIN

Wafer level packaging bond

LIN HUNG-HUA

Biological sensing structures and methods of forming the same

CHENG CHUN-REN

Handling layer for transparent substrate

HUANG Xin-hua

Systems and methods of separating bonded wafers

KALNITSKY ALEX

Power devices having reduced on-resistance and methods of their manufacture