Inventor

HSIEH YUAN-CHIH

TW93 patents

⚠️ This page may combine multiple inventors who share the name “HSIEH YUAN-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSIEH YUAN-CHIH

TAIWAN SEMICONDUCTOR MFG CO LTD

Transfer module for bowed wafers

Micro electromechanical system sensor and method of forming the same

Integrate rinse module in hybrid bonding platform

Semiconductor MEMS structure and manufacturing method thereof

Structure to reduce backside silicon damage

Noble gas bombardment to reduce scallops in bosch etching

Integrate rinse module in hybrid bonding platform

Semiconductor MEMS structure

Packaging method and associated packaging structure

Semiconductor arrangement and formation thereof

Semiconductor MEMS structure

Structure to reduce backside silicon damage

Semiconductor arrangement and formation thereof

Pizoelectric MEMS device with electrodes having low surface roughness

Pizoelectric MEMS device with electrodes having low surface roughness

Structure for microelectromechanical systems (MEMS) devices to control pressure at high temperature

Method to protect electrodes from oxidation in a MEMS device

Packaging method and associated packaging structure

Integrate rinse module in hybrid bonding platform

Integrate rinse module in hybrid bonding platform

Packaging method and associated packaging structure

MEMs using outgassing material to adjust the pressure level in a cavity

Segmented pedestal for mounting device on chip

Integrate rinse module in hybrid bonding platform

Segmented pedestal for mounting device on chip

Methods for patterning a silicon oxide-silicon nitride-silicon oxide stack and structures formed by the same

Semiconductor MEMS structure

Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure

Conductive bond structure to increase membrane sensitivity in MEMS device

Undercut-free patterned aluminum nitride structure and methods for forming the same

Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure

Structure for microelectromechanical systems (MEMS) devices to control pressure at high temperature

TAIWAN SEMICONDUCTOR MFG

Methods for fabricating image sensor devices

Method of fabricating backside illuminated image sensor

Semiconductor device with bonding pad

Method of making wafer structure for backside illuminated color image sensor

Methods for fabricating image sensor devices

Reduced refractive index and extinction coefficient layer for enhanced photosensitivity

HSIEH YUAN-CHIH

Semiconductor having a high aspect ratio via

Semiconductor having a high aspect ratio via

Semiconductor having a high aspect ratio via

LIU PING-YIN

MEMS structures and methods for forming the same

Self-removal anti-stiction coating for bonding process

LIU MARTIN

Wafer level packaging bond

LIN CHUNG-HSIEN

Multiple bonding in wafer level packaging

CHU RICHARD

Hermetic wafer level packaging

HUANG HSIN-TING

Method of fabricating a semiconductor device having recessed bonding site

LIN HUNG-HUA

Biological sensing structures and methods of forming the same

CHENG CHUN-REN

Handling layer for transparent substrate

HUANG Xin-hua

Methods of bonding caps for MEMS devices