Inventor
WANG CHIN-SHENG
TW30 patents
⚠️ This page may combine multiple inventors who share the name “WANG CHIN-SHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNIMICRON TECHNOLOGY CORP
15 patentsUS11690173B2Jun 27, 2023
Circuit board structure
UNIMICRON TECHNOLOGY CORP4 citations75
US11943877B2Mar 26, 2024
Circuit board structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP1 citations62
US12588135B2Mar 24, 2026
Method of manufacturing circuit board
UNIMICRON TECHNOLOGY CORP0 citations61
US12504591B2Dec 23, 2025
Co-packaged structure for optics and electrics
UNIMICRON TECHNOLOGY CORP0 citations61
US11445596B2Sep 13, 2022
Circuit board having heat-dissipation block and method of manufacturing the same
UNIMICRON TECHNOLOGY CORP0 citations61
US12568810B2Mar 3, 2026
Anti-diffusion substrate structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations60
US12469769B2Nov 11, 2025
Electronic packaging structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations57
US12200861B2Jan 14, 2025
Circuit board structure
UNIMICRON TECHNOLOGY CORP0 citations52
US10714448B2Jul 14, 2020
Chip module with porous bonding layer and stacked structure with porous bonding layer
UNIMICRON TECHNOLOGY CORP0 citations52
US11373927B2Jun 28, 2022
Package substrate and manufacturing method having a mesh gas-permeable structure disposed in the through hole
UNIMICRON TECHNOLOGY CORP0 citations51
US12557711B2Feb 17, 2026
Electronic package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US12506056B2Dec 23, 2025
Electronic package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US11715715B2Aug 1, 2023
Metal bump structure and manufacturing method thereof and driving substrate
UNIMICRON TECHNOLOGY CORP0 citations48
US12347912B2Jul 1, 2025
Multi-layered resonator circuit structure and multi-layered filter circuit structure
UNIMICRON TECHNOLOGY CORP0 citations46
US10515870B1Dec 24, 2019
Package carrier having a mesh gas-permeable structure disposed in the through hole
UNIMICRON TECHNOLOGY CORP0 citations41
SUBTRON TECHNOLOGY CO LTD
5 patentsUS9870931B2Jan 16, 2018
Package carrier and manufacturing method thereof
SUBTRON TECHNOLOGY CO LTD2 citations72
US9591753B2Mar 7, 2017
Circuit board and manufacturing method thereof
SUBTRON TECHNOLOGY CO LTD3 citations63
US10177067B2Jan 8, 2019
Manufacturing method of package carrier
SUBTRON TECHNOLOGY CO LTD1 citations60
US10319610B2Jun 11, 2019
Package carrier
SUBTRON TECHNOLOGY CO LTD0 citations51
US9458540B2Oct 4, 2016
Package substrate and manufacturing method thereof
SUBTRON TECHNOLOGY CO LTD0 citations41
WANG CHIN-SHENG
4 patentsUS8859908B2Oct 14, 2014
Package carrier
WANG CHIN-SHENG14 citations82
US9433099B2Aug 30, 2016
Package carrier
WANG CHIN-SHENG0 citations38
US9282643B2Mar 8, 2016
Core substrate and method for fabricating circuit board
WANG CHIN-SHENG0 citations38
US9204546B2Dec 1, 2015
Circuit board and manufacturing method thereof
WANG CHIN-SHENG0 citations37