Inventor
DYSARD JEFFREY
US28 patents
⚠️ This page may combine multiple inventors who share the name “DYSARD JEFFREY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CABOT MICROELECTRONICS CORP
24 patentsUS9127187B1Sep 8, 2015
Mixed abrasive tungsten CMP composition
CABOT MICROELECTRONICS CORP24 citations92
US7994057B2Aug 9, 2011
Polishing composition and method utilizing abrasive particles treated with an aminosilane
CABOT MICROELECTRONICS CORP30 citations92
US9309442B2Apr 12, 2016
Composition for tungsten buffing
CABOT MICROELECTRONICS CORP6 citations84
US9303188B2Apr 5, 2016
Composition for tungsten CMP
CABOT MICROELECTRONICS CORP14 citations84
US9238754B2Jan 19, 2016
Composition for tungsten CMP
CABOT MICROELECTRONICS CORP9 citations84
US9567491B2Feb 14, 2017
Tungsten chemical-mechanical polishing composition
CABOT MICROELECTRONICS CORP7 citations83
US9556363B2Jan 31, 2017
Copper barrier chemical-mechanical polishing composition
CABOT MICROELECTRONICS CORP8 citations82
US9499721B2Nov 22, 2016
Colloidal silica chemical-mechanical polishing composition
CABOT MICROELECTRONICS CORP8 citations82
US9422456B2Aug 23, 2016
Colloidal silica chemical-mechanical polishing composition
CABOT MICROELECTRONICS CORP9 citations82
US9422457B2Aug 23, 2016
Colloidal silica chemical-mechanical polishing concentrate
CABOT MICROELECTRONICS CORP7 citations82
US7897061B2Mar 1, 2011
Compositions and methods for CMP of phase change alloys
CABOT MICROELECTRONICS CORP14 citations81
US9803106B2Oct 31, 2017
Methods for fabricating a chemical-mechanical polishing composition
CABOT MICROELECTRONICS CORP4 citations80
US11034862B2Jun 15, 2021
Polishing composition and method utilizing abrasive particles treated with an aminosilane
CABOT MICROELECTRONICS CORP1 citations73
US9303189B2Apr 5, 2016
Composition for tungsten CMP
CABOT MICROELECTRONICS CORP4 citations73
US9303190B2Apr 5, 2016
Mixed abrasive tungsten CMP composition
CABOT MICROELECTRONICS CORP5 citations72
US8906252B1Dec 9, 2014
CMP compositions selective for oxide and nitride with high removal rate and low defectivity
CABOT MICROELECTRONICS CORP4 citations72
US9434859B2Sep 6, 2016
Chemical-mechanical planarization of polymer films
CABOT MICROELECTRONICS CORP3 citations71
US9617450B2Apr 11, 2017
Polishing composition and method utilizing abrasive particles treated with an aminosilane
CABOT MICROELECTRONICS CORP1 citations62
US9165489B2Oct 20, 2015
CMP compositions selective for oxide over polysilicon and nitride with high removal rate and low defectivity
CABOT MICROELECTRONICS CORP2 citations60
US10508219B2Dec 17, 2019
Polishing composition and method utilizing abrasive particles treated with an aminosilane
CABOT MICROELECTRONICS CORP0 citations52
US9566686B2Feb 14, 2017
Composition for tungsten CMP
CABOT MICROELECTRONICS CORP1 citations52
US8623767B2Jan 7, 2014
Method for polishing aluminum/copper and titanium in damascene structures
CABOT MICROELECTRONICS CORP0 citations52
US9281210B2Mar 8, 2016
Wet-process ceria compositions for polishing substrates, and methods related thereto
CABOT MICROELECTRONICS CORP1 citations47
US9340706B2May 17, 2016
Mixed abrasive polishing compositions
CABOT MICROELECTRONICS CORP0 citations36